Article View: alt.comp.hardware
Article #349Re: Intel Price Drop?
From: Paul DeMone
Date: Sat, 01 Aug 1998 00:00
Date: Sat, 01 Aug 1998 00:00
48 lines
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3682 bytes
biggfredd@NOSPAMcomputech-online.net wrote: [snip] > When factoring in design costs and the costs of building new facilities, etc > (that is, unit cost accounting) those figures are certainly correct. But as > my original post was worded, the materials (only) in a chip probably aren't > more than 50 cents. Put another way, the incremental cost of the next > additional chip isn't very much. The incremental cost of the next chip is certainly more than 50 cents. You are correct in that raw materials are cheap (silicon, oxygen, and aluminum are some of the most common elements in the earth's crust) but this is like an insurance company trying to settle with someone's benefactors for $10 because a dead body only has $10 worth of chemicals in it. You start with sand (special kind) and reduce it to metalurgical grade silicon. You then zone refine it to an utterly incredible level of purity to obtain electronic quality silicon. You then have to melt it and then pull a 8" diameter single crystal boule from the crucible for slicing into a wafer. The wafer is polished and possibly gettered and at this stage is probably worth several tens of dollars. You then run it through a fab where it goes through many dozens of repetitive steps of lithography, etching, implantation, polishing etc using very expensive machinery, very expensive chemicals, and tons of high purity deionized water, in an expensive, vibration isolated and highly filtered clean room facility. The finished 8" wafer processed in say a 0.25 um, 5 level metal CMOS process has probably cost you several thousand dollars so far. You have to probe the wafer (i.e. step a probe card across the wafer stopping at each potential die site to run basic functional tests and ink the bad die while occupying a multi million dollar tester). You have just added hundreds of dollars of cost to your now tested wafer. The probed wafer is now shipped off-shore for slicing and packaging (maybe several cents per pin or more depending on package type). You now have to retest each packaged die but with a longer, more extensive final test program that occupies the many hundreds of dollar per hour tester for possibly several minutes per device. For a PC class micro the variable cost is probably $40 - $80 per device and twice that for a workstation/server class device. Not quite 50 cents! All opinions strictly my own. -- Paul W. DeMone The 801 experiment SPARCed an ARMs race Kanata, Ontario to put more PRECISION and POWER into demone@mosaid.com architectures with MIPSed results but PaulDeMone@EasyInternet.net ALPHA's well that ends well.
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X-Google-Language: ENGLISH,ASCII-7-bit X-Google-Thread: 113106,291316b76d2bf713 X-Google-Attributes: gid113106,public X-Google-Thread: f5f89,291316b76d2bf713 X-Google-Attributes: gidf5f89,public X-Google-Thread: 1045b9,291316b76d2bf713 X-Google-Attributes: gid1045b9,public X-Google-Thread: 110292,291316b76d2bf713 X-Google-Attributes: gid110292,public From: Paul DeMone <PaulDeMone@EasyInternet.net> Subject: Re: Intel Price Drop? Date: 1998/08/01 Message-ID: <35C29448.1ED3@EasyInternet.net> X-Deja-AN: 376878897 Content-Transfer-Encoding: 7bit References: <35be7747.0@news.snowhill.com> <6ppph2$mh5$1@news2.ee.net> <35C10CD4.403D@mordor.com> <MDiw1.375$bd2.243286@newsfeed.slurp.net> Content-Type: text/plain; charset=us-ascii Organization: UUNET Canada News Transport Mime-Version: 1.0 Newsgroups: alt.comp.hardware,comp.sys.ibm.pc.hardware.chips,comp.sys.intel,3dfx.game.support