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Article #12204Three-Level Metal
From: Donald Lindsay
Date: Fri, 21 Jun 1991 04:22
Date: Fri, 21 Jun 1991 04:22
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I notice that the new i860 is built with a 3-level-metal process. I recall that Motorola promised to build the 88110 this way, and someone posted here expressing disbelief. So, is the i860 really the first? And how many of the upcoming superscalars will be three layer? -- Don D.C.Lindsay Carnegie Mellon Robotics Institute
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arc1-ca.pugleaf.net!utzoo!utgpu!news-server.csri.toronto.edu!cs.utexas.edu!swrinde!zaphod.mps.ohio-state.edu!ub!galileo.cc.rochester.edu!rochester!pt.cs.cmu.edu!gandalf.cs.cmu.edu!lindsayShow Full Headers
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Path: arc1-ca.pugleaf.net!utzoo!utgpu!news-server.csri.toronto.edu!cs.utexas.edu!swrinde!zaphod.mps.ohio-state.edu!ub!galileo.cc.rochester.edu!rochester!pt.cs.cmu.edu!gandalf.cs.cmu.edu!lindsay From: lindsay@gandalf.cs.cmu.edu (Donald Lindsay) Newsgroups: comp.arch Subject: Three-Level Metal Message-ID: <13560@pt.cs.cmu.edu> Date: 21 Jun 91 04:22:07 GMT Organization: Carnegie Mellon Lines: 10