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Article #12236Re: Three-Level Metal
From: Renu Raman
Date: Sun, 23 Jun 1991 08:55
Date: Sun, 23 Jun 1991 08:55
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In article <4977@spim.mips.COM> wilkes@mips.com (John Wilkes) writes: >In article <13560@pt.cs.cmu.edu> lindsay@gandalf.cs.cmu.edu (Donald Lindsay) writes: >> >>So, is the i860 really the first? And how many of the upcoming >>superscalars will be three layer? > >The MIPS R6000 ECL processor, R6010 floating point controller and R6020 >system bus chip are all three layer metal. Many ECL processes have had 3LM for sometime. What D. Lindsay was refererring to is CMOS components (some current ECL and GaAS use 4 layers of metal interconnect). The new PA components are in a 1.0 micron 3LM process. >-wilkes <wilkes@mips.com> -- -------------------------------- Renukanthan Raman ARPA:ram@sun.com M/S 16-11, 2500 Garcia Avenue, TEL :415-336-1813 Sun Microsystems, Mt. View, CA 94043
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Path: arc1-ca.pugleaf.net!utzoo!utgpu!news-server.csri.toronto.edu!rpi!usc!apple!amdcad!sun!exodus!shukra.Eng.Sun.COM!ram From: ram@shukra.Eng.Sun.COM (Renu Raman) Newsgroups: comp.arch Subject: Re: Three-Level Metal Message-ID: <15662@exodus.Eng.Sun.COM> Date: 23 Jun 91 08:55:58 GMT References: <13560@pt.cs.cmu.edu> <4977@spim.mips.COM> Sender: news@exodus.Eng.Sun.COM Organization: Sun Microsystems, Mt. View, Ca. Lines: 21