Article View: comp.arch
Article #20713Re: DARPA supercomputer
From: Paul Rodman
Date: Mon, 10 Apr 1989 00:15
Date: Mon, 10 Apr 1989 00:15
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In article <2866@uokmax.UUCP> les@uokmax.UUCP (The Doctor) writes: > <Stuff about Cray 3> This 10in cube.......... Was the DARPA spec for a 10in cube or 10 cubic inches? :-):-):-) >detail about it, but the main issue is they are using GaAs chips which are >very miniaturized. Nope. The Gas chips are pretty tame, size-wise. Its the packaging method that connects things in the 3rd dimension with 12,000 hair-thin wires from board to board that boggles the mind. To save on the 3rd dimension they also have to grind down the *thickness* of the die as they come from Gigabit, else a basic cpu would be 2 inches think, not 1 inch. Gag! what does that do to the net yield? Bye, Paul K. Rodman rodman@Multiflow.com
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Path: arc1-ca.pugleaf.net!utzoo!utgpu!jarvis.csri.toronto.edu!mailrus!csd4.milw.wisc.edu!lll-winken!uunet!mfci!rodman From: rodman@mfci.UUCP (Paul Rodman) Newsgroups: comp.arch Subject: Re: DARPA supercomputer Message-ID: <761@m3.mfci.UUCP> Date: 10 Apr 89 00:15:23 GMT References: <2866@uokmax.UUCP> Sender: rodman@mfci.UUCP Reply-To: rodman@mfci.UUCP (Paul Rodman) Distribution: usa Organization: Multiflow Computer Inc., Branford Ct. 06405 Lines: 21