Article View: comp.arch
Article #20736Re: DARPA supercomputer
From: Keith Garrett
Date: Wed, 12 Apr 1989 20:48
Date: Wed, 12 Apr 1989 20:48
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1326 bytes
In article <761@m3.mfci.UUCP> rodman@mfci.UUCP (Paul Rodman) writes:
<Stuff about Cray 3 and GaAs>
>To save on the 3rd dimension they also have to grind down the *thickness*
>of the die as they come from Gigabit, else a basic cpu would be 2 inches
>think, not 1 inch. Gag! what does that do to the net yield?
semiconductor manufacturers have been grinding the backs of of wafers for
years. most (probably all) IC's you can buy today lost material off their
backsides right before being placed in packages. the process is simple and
shouldn't add defects to the active region (there is some evidence that
back grinding traps defects away from the active region, improving yield)
--
Keith Garrett "This is *MY* opinion, OBVIOUSLY"
UUCP: keith@mips.com or {ames,decwrl,prls}!mips!keith
USPS: Mips Computer Systems,930 Arques Ave,Sunnyvale,Ca. 94086
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Path: arc1-ca.pugleaf.net!utzoo!utgpu!jarvis.csri.toronto.edu!mailrus!tut.cis.ohio-state.edu!bloom-beacon!apple!vsi1!daver!mips!keith From: keith@mips.COM (Keith Garrett) Newsgroups: comp.arch Subject: Re: DARPA supercomputer Message-ID: <17108@gumby.mips.COM> Date: 12 Apr 89 20:48:04 GMT References: <2866@uokmax.UUCP> <761@m3.mfci.UUCP> Reply-To: keith@mips.COM (Keith Garrett) Distribution: usa Organization: MIPS Computer Systems, Sunnyvale, CA Lines: 15