Article View: comp.arch
Article #21810Re: 80960KA and KB
From: Dave Rand
Date: Fri, 22 Dec 1989 05:52
Date: Fri, 22 Dec 1989 05:52
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1286 bytes
In article <1989Dec20.014428.9785@daver.UU.NET> dlr@daver.UU.NET (Dave Rand) writes:
>Does anyone know the die size and technology used on the 80960KA and
>80960KB parts?
Well - the die size is 400x400, in case anyone is interested. No one
replied, so we cracked one open to have a peek. The pads are all
on one corner of the die (strange, just like the pinout :-), and they
appear to use a multi-layer assembly to carry the signals to the
external PGA pins. The die looks packed, with features right to
the edge where there are not pads. I assume that it is 1.2 micro
geometry, but we haven't checked this yet. If anyone has more
information, please let me know.
Wonder if this voids the warranty?
--
Dave Rand
{pyramid|hoptoad|sun|vsi1}!daver!dlr Internet: dlr%daver@uunet.uu.net
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<1989Dec22.055206.4848@daver.UU.NET>Path:
arc1-ca.pugleaf.net!utzoo!utgpu!jarvis.csri.toronto.edu!mailrus!tut.cis.ohio-state.edu!zaphod.mps.ohio-state.edu!usc!apple!vsi1!daver!dlrReferences:
<1989Dec20.014428.9785@daver.UU.NET>Show Full Headers
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Path: arc1-ca.pugleaf.net!utzoo!utgpu!jarvis.csri.toronto.edu!mailrus!tut.cis.ohio-state.edu!zaphod.mps.ohio-state.edu!usc!apple!vsi1!daver!dlr From: dlr@daver.UU.NET (Dave Rand) Newsgroups: comp.arch,comp.sys.intel Subject: Re: 80960KA and KB Message-ID: <1989Dec22.055206.4848@daver.UU.NET> Date: 22 Dec 89 05:52:06 GMT References: <1989Dec20.014428.9785@daver.UU.NET> Reply-To: dlr@daver.UUCP (Dave Rand) Organization: Association for the Prevention of Polar Bears and Kangaroos Lines: 17