Article View: comp.arch
Article #3419Re: Cool CMOS at ECL speeds (?)
From: Tom Shott
Date: Wed, 17 Jan 1990 18:36
Date: Wed, 17 Jan 1990 18:36
38 lines
2355 bytes
2355 bytes
In article <34525@mips.mips.COM> mark@mips.COM (Mark G. Johnson) writes:
Opinion, not data, follows; flame-broil me if you must...
On each project, chip engineers design their parts to fit within the
power budget allocated for that chip. That's why you can't take the
power per transistor per megahertz of the 386, multiply it by the
number of transistors on the i860 times the clock rate of the i860,
and get the power dissipation of the i860. The 386 and the 860 were
each _designed_ for a particular power dissipation. Apparently the
860's goal was moderately low power; hat's off to R. Albers &co for
getting it so low.
Both higher performance and level power dissipation for new processors are a
result of improved fabrication processes. Improved processes have smaller
feature sizes which result in 1M + transistor chips. It also means more
devices for the same Cap value. Thus higher performance with a flat power
curve.
Opinion On:
I don't speak for Intel. (Well, hardly ever). Data sheets often have a
maximum power dissipation. This number is arrived at by finding a group of
chips at the edge of passing specs. Then all the available test sets are
run on the chips at the conditions stated in the specs for DC values and
loads. The highest power consumption noted is used. Thus your mileage may
very depending on output loading, software, etc. I don't know how we arrive
at "typical" power dissipation.
Opinion Off:
--
-----------------------------------------------------------------------------
Tom Shott INTeL, 2111 NE 25th Ave., Hillsboro, OR 97123, (503) 696-4520
toms@omews44.intel.com OR toms%omews44.intel.com@csnet.relay.com
INTeL.. Designers of the 960 Superscalar uP and other uP's
Technical Details
Message-ID:
<TOMS.90Jan17133644@omews44.intel.com>Path:
arc1-ca.pugleaf.net!utzoo!utgpu!jarvis.csri.toronto.edu!cs.utexas.edu!swrinde!zaphod.mps.ohio-state.edu!brutus.cs.uiuc.edu!apple!oliveb!orc!mipos3!omepd!tomsReferences:
<105@zds-ux.UUCP> <34525@mips.mips.COM>Show Full Headers
Complete Article Headers
Path: arc1-ca.pugleaf.net!utzoo!utgpu!jarvis.csri.toronto.edu!cs.utexas.edu!swrinde!zaphod.mps.ohio-state.edu!brutus.cs.uiuc.edu!apple!oliveb!orc!mipos3!omepd!toms From: toms@omews44.intel.com (Tom Shott) Newsgroups: comp.arch Subject: Re: Cool CMOS at ECL speeds (?) Message-ID: <TOMS.90Jan17133644@omews44.intel.com> Date: 17 Jan 90 18:36:44 GMT References: <105@zds-ux.UUCP> <34525@mips.mips.COM> Sender: news@omepd.UUCP Organization: OME, INTeL Corp., Hillsboro, Oregon Lines: 38 In-reply-to: mark@mips.COM's message of 16 Jan 90 15:39:55 GMT