Thread View: comp.arch
1 messages
1 total messages
Started by Martin Freeman
Tue, 31 May 1994 20:57
ADVANCE PROGRAM: HOT CHIPS SYMPOSIUM VI
Author: Martin Freeman
Date: Tue, 31 May 1994 20:57
Date: Tue, 31 May 1994 20:57
404 lines
14687 bytes
14687 bytes
Just When You thought It Was Safe To Go On Vacation
HOT CHIPS SYMPOSIUM VI
A Symposium on High-Performance Chips
(Advance Program)
Sponsored by the IEEE Computer Society
Technical Committee on Microprocessors
Stanford University, Palo, Alto, California
Memorial Auditorium
August 14-16, 1994
Attend HOT Chips VI, a symposium on high-performance chips, which will bring
together researchers and developers of chips used to construct high-performance
workstations and systems. Enjoy the informal format offering interaction with
speakers. The first five HOT Chips Symposiums were huge successes and prompted
articles in five special issues of IEEE Micro magazine. This year's HOT Chips
VI will again bring you the latest developments in chip technology.
ORGANIZING COMMITTEE
General Chairman: John Mashey, Silicon Graphics
Vice Chairman: Nam Ling, Santa Clara University
Program Co-Chairmen: Alan J. Smith, UC Berkeley
Don Alpert, Intel
Finance Chairman: Dennis Reinhardt, Intel
Registration Chairman: Robert Stewart, Stewart Research
Publication Chairman: David Gustavson, SCI Technical Consortium
Publicity Chairman: S. Diane Smith, Consultant
Local Arrangements Chairmen: Alan Johnson,
Cary Kornfeld, Interval Research
Tutorials Chairman: Qiang Li Santa Clara University
At Large: Martin Freeman, Philips Research
John Hennessy, Stanford University
PROGRAM COMMITTEE
Donald Alpert, Intel (Program Co-Chairman)
Forest Baskett, Silicon Graphics
Alan Baum, Apple Computer
Anoop Gupta, Stanford University
Norman Jouppi DEC WRL
Ruby Lee, Hewlett Packard
Alan J. Smith, UC Berkeley (Program Co-Chairman)
PROGRAM
August 14, 1994
Tutorial Schedule:
7:30-8:30 Registration & Coffee at Memorial Auditorium
8:30-12:00 Algorithms & Hardware for Video Compression
12:00-1:00 Lunch
1:00-4:30 Instruction-Set Extension for Multiprocessor Interconnects
4:30-6:00 Wine & Cheese Reception in the Dohrman Grove
Just North of the Hoover Tower on Serra Street
Tutorial 1: Algorithms & Hardware for Video Compression
Teresa Meng, Stanford University
This tutorial will give an overview of the industry standards for video
compression, including compression algorithms, performance comparisons
and hardware implementations. Fast algorithms to achieve real-time
encoding and decoding will be one focus of this tutorial. Besides
industry standards, recent developments in compression techniuqes, such
as subband and wavelet filtering and vector quantization will be
covered. Finally research activities in the area of low-power
implementations for portable video applications will be surveyed.
Tutorial 2: Instruction-Set Extensions for Multiprocessor Interconnects
David James, Apple Computer
Most instruction sets have been optimized for uniprocessor
environments. To effectively utilize multiprocessors on scalable
interconnects, processors need to support additional capabilities,
including 64-bit addressing, a well-defined set of memory access
capabilities (loads, stores, and locks), non-blocking interrupts and
synchronized time-of-day clocks. As background, the constraints of a
typical high-speed interconnect, ANSI/IEEE Std 1596-1992 Scalable
Coherent Interface (SCI), are considered. We show that specialized
signals (such as bus-lock and interrupt) as well as eavesdrop or
broadcast-based protocols can be avoided, explicit lock instructions
(such as fetch&add) scale better than LoadReserved- and
StoreConditional-based instruction sequences, and mixed endian data
types (big and little) require minimal hardware (but significant
compiler) support. We show how these conditions impact the design of
processor instruction-set extensions.
August 15, 1994
9:00-9:15 Welcome and Opening Remarks
John Mashey, General Chair
Don Alpert, Alan Jay Smith, Program Co-Chairs
9:15-10:45 CPUs - 1
Session Chair: Norman Jouppi, DEC WRL
. An Overview of the 21164 Alpha AXP Microprocessor
Paul Rubinfeld, Digital Equipment Corp.
. The Power2+ Processor
David Shippy, IBM
. A 500MHz 32b 0.4um CMOS RISC Processor (Gallop)
Masakazu Yamashina, NEC Corporation
10:45-11:15 Break
11:15-12:45 Multiprocessor and Encryption
Session Chair: Howard Sachs, Sun Microsystems
. The Alewife CMMU: Addressing the Multiprocessor
Communications Gap
John Kubiatowicz, MIT
. nCube3 Integrated MPP Node Processor
Robert Duzett, nCube
. A 100Kbit/sec Single Chip Modular Exponentiation Processor
Holger Orup, Aarhus University, Denmark
12:45-2:15 Lunch
2:15-4:15 Networks, Communications
Session Chair: Forest Baskett, Silicon Graphics
. UAI2110: An Universal GaAs ATM Interface Chip
for High Speed Networks
Premysl Vaclavik, Thomas Neuroth GmbH, Austria
. CDMA Cellular Single Chip Cell Site Modem
Ken Easton, Qualcomm, Inc.
. A 500 MHz BiCMOS GByte/Second SCI-Link Implementation
Wayne Nation, IBM
. The STC104 Asynchronous Packet Switch
Peter Thompson, INMOS Ltd.
4:15-4:45 Break
4:45-6:15 CPUs - 2
Session Chair: Don Alpert, Intel
. The New i960 CPU that offers More for Less, the P100
Richard Brunner/Deif Atallah, Intel
. SH-II- A Low Power RISC Micro for Consumer Applications
Shumpei Kawasaki, Hitachi
. Breaking the Traditional RISC Rules (A new family of
scalable microprocessor cores)
Gideon Intranter, National Semiconductor
6:15-7:45 Buffet Dinner
7:45-9:45 Evening Panel Session
The Investor (Venture) Community View of What's Hot
Moderator: Forest Baskett
August 16, 1994:
8:30-10:00 Chipsets
Session Chair: Allen Baum, Apple Computer
. A PCI Bus ChipSet with Graphics Acceleration
Jesse Lawrendra, Vertex Semiconductor Corp.
. 82430NX PCIset: Companion to the Highest
Performance Pentium Processor
Patrick Correia, Intel Corporation
. A Power PC/PCI Bridge Chip with a
Cache and Memory Controller
Karl Wang, Motorola, Inc.
10:00-10:30 Break
10:30-12:30 Graphics
Session Chair: Ruby Lee, Hewlett Packard
. An ASIC for Interactive 3D Graphics
Stephanie Winner, Apple Computer Inc.
. GLiNT - a 3D Graphiucs Processor Based on the OpenGL Standard
Neil Trevett, DuPont Pixel
. The Smart Frame Buffer Goes Hollywood: 3D and TV
Joel McCormack, Digital Equipment Corporation
. A Cached VRAM for 3D Graphics
Michael Deering, SUN Microsystems
12:30-2:00 Lunch
2:00-3:30 Video
Session Chair: Anoop Gupta, Stanford University
. Video Compression Processor for H.320-to-Indeo Transcoding
Brian Martin, Integrated Information Technology
. A High Performance Programmable Multi-Standard
Video Compression Chip Set
David Still, Array Microsystems Inc.
. Multimedia Enhancements for PA-RISC Processors
Ruby Lee, Hewlett-Packard
3:30-4:00 Break
4:00-6:00 CPUs - 3
Session Chair: Alan J. Smith, UC Berkeley
. PowerPC 604
S. Peter Song, IBM
. The Thunder SPARC Processor
Bruce Lightner, Metaflow Technologies Inc.
. The Superscalar Hardware Architecture of the MC68060
Joe Circello, Motorola
. A High Performance, Low Power, Pentium Processor
Doug Carmean, Lawrence Clark, Robert Rozploch, Intel
6:00 Closing Remarks
HOUSING INFORMATION
Housing is available on the Stanford University campus in student
dormatories which are vacant in the summer. These have central lavatory
facilities and cost about $40 per night --- single, $50 per night ---
double, for the nights of the symposium. A key deposit of $50 is
required that will be refunded at checkout. Housing arrangements on the
Stanford campus must be made by August 4 through HOT Chips, not
Stanford.
Housing is also available at numerous hotels and motels on the
peninsula in Palo Alto, Menlo Park, Mountain View, and Los Altos within
5 miles of the campus. You are responsible for making such reservations
directly with the motel.
If you would like additional housing information, please check the housing
information request box on the registration form.
IEEE/Computer Society Membership
To join call John Gill at (202) 371-0101. With confirmation, you may
register for HOT Chips VI at member rates.
QUESTIONS?
For more information on registration and local arrangements contact Dr.
Robert Stewart at (415) 941-6699 or r.stewart@compmail.com.
REGISTRATION INCLUDES:
* Attendance * Sunday Evening Wine &
* One Copy of the Notes Cheese Reception
* Two Luncheons * Monday Evening Reception
* Coffee Breaks * Parking
A Stanford map, parking permit, the location of parking, and a receipt
will be mailed to early registrants.
ON-SITE REGISTRATION is available Sunday morning before the tutorial
and each morning at the Symposium. Early advanced registration is
recommended because of the large attendance.
Group discounts are available.
CANCELLATION OF REGISTRATION: Must be made in writing prior to Sunday,
August 7, 1994. A $40 fee will be charged for cancellation.
FEDERAL TAX ID NUMBER IS: 13-1656633 for the
Institute of Electrical & Electronic Engineers
345 E. 47th Street
New York, NY 10017
Use certified mail for registration confirmation.
=============================================================================
HOT CHIPS VI REGISTRATION FORM
Name________________________________________________________________________
Organization________________________________________________________________
Dept/Mail Stop______________________________________________________________
Mailing Address_____________________________________________________________
City/State/Zip______________________________________________________________
Country_____________________________________________________________________
Area Code/Phone #___________________________________________________________
Email Address_______________________________________________________________
FAX_________________________________________________________________________
Membership: IEEE/CS______ ACM_______
Student______ None______
Society Membership Number___________________________________________________
Check One:
______Check drawn on a U.S. Bank ______MasterCard
Make Check Payable To:
Hot Chips Symposium ______VISA
Name on Credit Card_________________________________________________________
Credit Card #_______________________________________________________________
Expiration Date_____________________________________________________________
Signature___________________________________________________________________
FEES: CIRCLE APPROPRIATE VALUES
Before After
July 22 July 22
IEEE/Computer Society $160 $230
or ACM Member
Non-Member $230 $290
Student Member $55 $100
Sunday Tutorials, Member $30 $45
Tutorials, Non-Member $45 $60
Tutorials, Student $20 $30
Extra Copy of Notebook $30 $30
(with no mailing)
Stanford University Dormitory Housing
______ nights @$40 per night single; $50 double $_________
Arrival__________________ Departure___________________
TOTAL AMOUNT PAID ______________
Electronic Registration, paid via VISA or Mastercard Registration:
FAX: (415) 941-5048
EMAIL: r.stewart@compmail.com
Surface Mail Registration To:
Dr. Robert G. Stewart
Stewart Research Enterprises
1658 Belvoir Drive
Los Altos, CA 94024
Do NOT put me on the Hot Chips Mailing List _____
Stanford University Housing Information Requested _____
Thread Navigation
This is a paginated view of messages in the thread with full content displayed inline.
Messages are displayed in chronological order, with the original post highlighted in green.
Use pagination controls to navigate through all messages in large threads.
Back to All Threads