Thread View: comp.arch
1 messages
1 total messages
Started by Richard Auletta
Tue, 19 Mar 2002 16:40
ASIC/SOC 2002 CALL FOR CORPORATE PARTICIPATION AND PAPERS
Author: Richard Auletta
Date: Tue, 19 Mar 2002 16:40
Date: Tue, 19 Mar 2002 16:40
141 lines
9183 bytes
9183 bytes
ASIC/SOC 2002 CALL FOR CORPORATE PARTICIPATION AND PAPERS
The annual IEEE 2002 ASIC/SOC Conference is preparing for its 15th confer-
ence in Rochester New York from September 25th through the 28th, and while
last year's conference on September 12th had to be canceled, this year's
conference will be better than ever.
The ASIC/SOC Conference, sponsored by the Institute of Electrical and
Electronics Engineers, covers all aspects of Application Specific Inte-
grated Circuits and Systems on a Chip, and attracts over 200 ASIC/SOC
engineers, researchers, and educators from around the world.
ASIC/SOC offers industry a place to learn about the most current ASIC/SOC
developments and hear leaders in the field, such as Wilf Corrigan the
founder and CEO of LSI Logic, and Hirokazu Hashimoto the President and CEO
of NEC Electronics, address current issues facing the industry.
While ASIC/SOC is an excellent place for engineers to learn about the most
recent engineering developments, it is also an ideal place for companies
to reach a very focused audience about advances in CAD and EDA tools, ASIC
components/boards, equipment, and career opportunities.
Again this year, ASIC/SOC will accept a limited number of Corporate Spon-
sors for coffee breaks, cocktail parties, and our banquet. Sponsors will
appear in the ASIC/SOC published program, appear on the ASIC/SOC web page,
and have the opportunity to exhibit and display posters and distribute
brochures for the entire conference.
If your company is interested in exhibiting at ASIC/SOC 2002 please con-
tact me at the address below or the ASIC/SOC Conference office at
301-527-0900 x104, but either way, please distribute the attached Call for
Papers to your employees world-wide and visit the ASIC/SOC 2002 web page
at http://asic.union.edu.
Sincerely
Dr. Richard Auletta
Publications/Publicity Chair ASIC/SOC 2002
rauletta@orci.com
(303) 530-3640
***********************************************************************
* CALL FOR PAPERS *
* DEADLINE FOR PAPER SUBMISSION: APRIL 12, 2002 *
* *
* 15th Annual IEEE International ASIC/SOC Conference *
* September 25-28, 2002 *
* RIT Inn and Conference Center, Rochester, New York *
***********************************************************************
Driven by the rapid growth of the Internet, communication
technologies, pervasive computing, and wireless and portable consumer
electronics, Systems-on-Chip (SoC) have become a dominant issue in
today's ASIC industry. The transition from traditional Application-
Specific-Integrated-Circuits (ASIC) to SoCs has created new
challenges in Design Methods, Design Tools, Design Automation,
Manufacturing, Technology and Test. The ASIC/SoC Conference provides
a forum for sharing advances in ASIC and SoC technology and
applications. The 2002 Conference will offer three days of technical
papers and a full day of technical workshops. The IEEE Circuits and
Systems Society sponsors the ASIC/SoC Conference.
GENERAL INFORMATION
This year's ASIC/SOC Conference will be held at the Rochester Institute of
Technology Inn and Conference Center. Rochester New York is served by the
Greater Rochester International Airport and is within easy driving distance
of the Buffalo International Airport and most of New England.
Accommodations will be available for $79.00 a night at the RIT Inn.
Rochester, the third largest urban area in New York State, offers a wide
range of cultural, historic, and recreational activities within the relaxed
atmosphere of upstate New York.
TECHNICAL SCOPE
Papers are invited which address new and previously unpublished results in
the following categories or in related areas. Proposals for tutorial
papers, tutorials, workshops, and panel sessions are also invited. The
best paper will be acknowledged with a best paper award.
Applications SoC Specific Design Methodologies
------------------------------------------------------------------------
A1 Communication, Networking, S1 Reusable & Embedded
Internet, e-Business Cores/Macros, Memories
A2 Signal/Image Processing, S2 Technology Independent
Multimedia Methodologies
A3 Portable & Wireless Systems S3 On-Chip Buses for SoC
A4 Wireless/Pervasive Computing S4 Smart Sensors Integration
A5 Consumer and Defense S5 Design of Reconfigurable SoCs
Electronics
A6 FPGAs and Reconfigurable SoCs S6 SoC/IP Validation
A7 Other SoC Applications
Common Design Methodologies Enabling Technologies for SoC
------------------------------------------------------------------------
D1 High Performance, Low Power T1 Embedded DRAMs/Flash Memories
Design
D2 Analog & Mixed-Signal Design T2 Sensors/MEMS
D3 HW/SW Co-Design T3 Deep Sub-micron Technologies
D4 Timing Methodologies, Sync/Async T4 Optical Interconnects
Design, Clocking
D5 Reconfigurable/Scalable Design
Manufacturing Common SoC Issues
------------------------------------------------------------------------
M1 Signal Integrity & EMI C1 Project Management, Distributed
Development Teams
M2 Packaging & I/O Interfacing C2 Intellectual Property, Patent
and Legal Issues
M3 SoC Testing, Power Measurement, C3 SoC Success Stories, Case
Burn-In Studies
M4 SoC Fabrication Technologies C4 Future SoC Trends and Limits
C5 SoC Overview and Tutorial Papers
PAPER SUBMISSION
Electronic paper submission requires a 25 word condensed abstract for the
Advance Program, and the full paper, limited to five double-column IEEE
format pages, including figures and references. Please refer to the
conference web page at http://asic.union.edu for paper formatting and paper
submission as an Adobe PDF file.
ORGANIZING COMMITTEE
General Chair Technical Chair Technical Co-Chair
P. R. Mukund John Chickanosky Dong Ha
RIT IBM Virginia Tech
prmeee@rit.edu chickano@us.ibm.com ha@vt.edu
Pubs/Publicity Chair Steering Committee Chair Workshop Chair
Richard Auletta Thomas Buchner Ram Krishnamurthy
LSI Logic IBM Boblingen Lab Intel Corporation
rauletta@acm.org tbuechner@de.ibm.com ramk@hf.intel.com
DEADLINE FOR PAPER SUBMISSION: APRIL 12, 2002
NOTIFICATION OF PAPER ACCEPTANCE: MAY 31, 2002
FINAL CAMERA-READY PAPERS DUE: JUNE 28, 2002
Please visit the Conference web site at http://asic.union.edu or contact
the ASIC/SoC Conference office at 301-527-0900 x104 for paper submission,
registration, and current conference information.
Sponsored by the IEEE Circuits and Systems Society
************************************************************************
Thread Navigation
This is a paginated view of messages in the thread with full content displayed inline.
Messages are displayed in chronological order, with the original post highlighted in green.
Use pagination controls to navigate through all messages in large threads.
Back to All Threads