Thread View: comp.doc.techreports
1 messages
1 total messages
Started by Jean McKnight
Mon, 04 Jan 1993 23:14
UCSC revised TR: Optimal Design of Self-Damped Lossy Transmission Lines in a Tree Network for Multichip Module
Author: Jean McKnight
Date: Mon, 04 Jan 1993 23:14
Date: Mon, 04 Jan 1993 23:14
62 lines
3870 bytes
3870 bytes
University of California at Santa Cruz
Baskin Center for Computer Engineering and Information Sciences
The following technical report is available electronically or as
a paper copy. Instructions for getting either follow the abstract.
UCSC-CRL-92-11 (available electronically as ucsc-crl-92-11.ps.Z)
OPTIMAL DESIGN OF SELF-DAMPED LOSSY TRANSMISSION LINES IN A TREE
NETWORK FOR MULTICHIP MODULE
Jimmy S.-H. Wang and Wayne W.-M. Dai
April 1992, revised December 1992, 19 pages (paper copy $5.00)
Abstract: This paper addresses some of the problems encountered in
propagating high-speed signals through lossy transmission lines on the
substrates of silicon-on-silicon thin-film multichip modules (MCM).
Instead of terminated by resistors, the lossy lines on the thin-film
multichip modules can be structured to critically damp out the signal
resonances, they are thus called *optimal, self-damped lossy
transmission lines*. It is easiest to manufacture interconnection
lines with fixed metal and dielectric thicknesses, and vary only the
line width. This results in specific dependency of line width on
length for self-damped lines. In this paper, we present the a simple
and robust method of designing self-damped lossy transmission lines in
a tree network for multichip module. We vary the width of each branch
of the network to meet certain electrical damping criteria. This
results in stable operation as long as the lossy transmission line is
shorter than the quarter wave length of the highest frequency component
of interests. The lengths of lines on the silicon-on-silicon thin-film
MCM substrate usually does not exceed this limit. If certain designs
require larger substrate or higher speed, the materials and structural
properties of the substrate (for example the dielectric thickness)
is changed according to the method.
Keywords: transmission line, lossy, self-damped, critical damped,
multichip module, multi-terminal network, distributed termination.
This technical report is available electronically through either
of the following methods:
1. through anonymous ftp from ftp.cse.ucsc.edu, in /pub/tr. Log in
as "anonymous", use your email address as your password, specify
"binary" before getting the file. Uncompress before printing.
2. by mail to automatic mail server rnalib@ftp.cse.ucsc.edu.
Put this command on the subject line or in the body of the message:
@@ send ucsc-crl-92-11.ps.Z from tr
To get the index or abstract list:
@@ send INDEX from tr
@@ send ABSTRACTS.1992 from tr
To get the list of the tr directory:
@@ list tr
To get the list of commands and their syntax:
@@ help commands
Order paper copies from: Technical Library, Baskin Center for Computer
Engineering & Information Sciences, UCSC, Santa Cruz CA 95064.
Purchase orders are not accepted. Checks or money orders must be
for U.S. dollars, payable through a U.S. bank, and made out to
"UC Regents".
Questions: jean@cse.ucsc.edu
===========================================================================
Co-moderator: Richard Golding, Computer & Information Sciences, UC Santa Cruz
compdoc-techreports-request@ftp.cse.ucsc.edu
Thread Navigation
This is a paginated view of messages in the thread with full content displayed inline.
Messages are displayed in chronological order, with the original post highlighted in green.
Use pagination controls to navigate through all messages in large threads.
Back to All Threads