high-density hybrid designs

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Article #846

#846

From: E. Shi
Date: Fri, 06 Jan 1989 04:08

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I understand there are several companies pursuing technologies
to design very high-density hybrid circuits.  Many large ICs could
sit on these hybrid circuits and thus handle many of the interconnect
problems typically associated with large systems.

Some companies that are working on these technologies are
RAYCHEM, UNISYS, HONEYWELL.  Anybody hear of others.  I heard
that DEC may have brought the old TRILOGY operations for their
technology.

 thanks
  ed
:x

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From: shi@bonnie.ics.uci.edu (E. Shi)
Newsgroups: comp.lsi.cad
Subject: high-density hybrid designs
Message-ID: <3184@paris.ics.uci.edu>
Date: 6 Jan 89 04:08:42 GMT
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Reply-To: shi@bonnie.ics.uci.edu (E. Shi)
Organization: University of California, Irvine - Dept of ICS
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