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Article #1206Re: Surface mounted packages
From: Gary Chin
Date: Wed, 14 Dec 1988 21:16
Date: Wed, 14 Dec 1988 21:16
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From article <6683@netnews.upenn.edu>, by blackman@eniac.seas.upenn.edu (David Blackman): > We have an application where we'd like to mount our custom VLSI dies into > a high density surface mounted package. Does anyone have any experience > with vendors of these packages? Also: how about any recommendations for > other types of high density packages. Due to cost considerations, we > are most interested in plastic packages. > > Thanks, > > David > Blackman@eniac.seas.upenn.edu Both National Semiconductor and LSI logic provide 160 pin quad plastic flat packs. These are specified to the EIAJ standards which is the Japanese standard. These packages are available in plastic from Seiko Epson and in ceramic from Kyocera.
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arc1-ca.pugleaf.net!utzoo!utgpu!attcan!uunet!lll-winken!lll-tis!helios.ee.lbl.gov!pasteur!agate!labrea!decwrl!sun!ssf!gchinReferences:
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Path: arc1-ca.pugleaf.net!utzoo!utgpu!attcan!uunet!lll-winken!lll-tis!helios.ee.lbl.gov!pasteur!agate!labrea!decwrl!sun!ssf!gchin From: gchin%ssf@Sun.COM (Gary Chin) Newsgroups: comp.lsi,sci.electronics Subject: Re: Surface mounted packages Message-ID: <81660@sun.uucp> Date: 14 Dec 88 21:16:06 GMT References: <6683@netnews.upenn.edu> Sender: news@sun.uucp Distribution: na Lines: 14