🚀 go-pugleaf

Here is the summary of the responses on MCM/COB/COF posting.
I thank all those who sent me the responses.

-- Burman
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'Multichip Modules' edited by Ernest S. Kuh
from World Scientific Publishing Co. Pte. Ltd. [Singapore]
     ISBN 981-02-0925-8
-------------------------------------------------
For the introductory-level article "A Multichip Module Primer - Does everybody
understand MCM's but you?", see "Printed Circuit Design", June 1992.
-------------------------------------------------
Thin Film Multichip Modules
George Messner
Twona Turlik
John W. Balde
Philip E. Garrou
A Technical Monograph of the International Society for
Hybrid Electronics
-------------------------------------------------
Multichip Modules Technologies and Alernatives: The Basics
Edited by: Daryl Doanne and Paul D. Franzon
Publisher: Van Nostrand Reinhold
-------------------------------------------------
One the leading Societies in MCM-L MCM-D and MCM-C is the
International society for Hybrid Microelectronics.  They have published
several books and have a bi-monthly journal.  I would recommend becoming a
member.  Their phone number is 800-232-4746.  I have been a member for 2
years and just got back from their 25th aniversary technical symposium in
CA.
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Multichip Modules:system advantages, major constraints, and materials 
technology

Edited by: R.W.Johnson
	   R.K.F.Teng
	   J.W.Balde

IEEE PRESS 1991.

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A very good introductory book covering many of the practical problems of
designing high speed digital microelectronic systems:

@book{Bakoglu90,
        author = "H.B. Bakoglu",
        title = "Circuits, Interconnections, and Packaging for VLSI",
        publisher = "Addisson Wesley",
        year = 1990}
                      
------------

An overview of MCM technology:

@article{Johnson90,
        author = "R.R. Johnson",
        title = "Multichip modules: next generation packages",
        journal = {IEEE Spectrum},
        month = mar,
        year =1990,
        pages = "34--36, 46--48",
        volume = 27,
        number = 3}
                    
--------------

An overview on how to match system requirements to MCM technology:

@inproceedings{Schaper90,
        author = "L. Schaper",
        title = "Meeting system requirements through technology
                tradeoffs in multichip modules",
        booktitle = "Proc. Int. Electronic Packaging Conference",
        year = 1990,
        pages = "25--33"}

--------------

Sources that go into more detail about high speed interconnect design.
These books are particularly aimed at ECL PCB design:


@book{MECL,
        author = "W.R. Blood~Jr.",
        title = "MECL System Design Handbook",
        publisher = "Motorola Inc.",
        year = 1983}
                        

@article{Davidson82,
        author = "E.E. Davidson",
        title = "Eletrical Design of a High Speed Computer Package",
        journal = "IBM J. Res. Dev.",
        volume = 26,
        number = 3,
        month = may,
        year = 1982,
        pages = "349--361"}
        
@incollection{Davidson89,
        author = "E.E. Davidson and G.A. Katopis",
        title = "Package Electrical Design",
        chapter = 3,
        booktitle = "Microlectronics Semiconductor Handbook",
        editor = "R.R. Tummala and E.J. Rymaszewski",
        publisher = "Van Nostrand Reinhold",
        year = 1989}

@inbook{Chang89,
        author = "C.S. Chang",
        title = "Electrical design methodologies",
        booktitle = "Electronic Materials Handbook",
        publisher = {ASM},
        year = 1989,
        pages = "25--44"}
                           
@inbook{Morrison89,
        author = "B.D. Morrison and J.J. Rosenberg and S.F. Mango",
        title = "Design Considerations for High-Frequency Digital
        Systems",
        booktitle = "Electronic Materials Handbook",
        publisher = {ASM},
        year = 1989,
        pages = "76--87"}

-------------

A discussion of the electronic design of digital circuits:


@inbook{Balph89,
        author = "T. Balph and W. Blood",
        title = "Active digital components",
        booktitle = "Electronic Materials Handbook",
        publisher = {ASM},
        year = 1989,
        pages = "160--177"}
                             
-------------

And finally a high level researcher-orientated overview of packaging 
hierarchies:

@article{FundaInter,
        author = "M. Hatamian  and L.A. Hornak and T.E. Little and S.K.
                Tewksbury and P. Franzon",
        title = "Fundamental interconnection issues",
        journal = "AT\&T Technical Journal",
        number = 4,
        volume = 66,
         pages = "13--30",
        month = "July/August",
        year = 1987}
                          
(also in  booktitle = "Electronic Materials Handbook",
        publisher = {ASM},
        year = 1989,
        pages = "1--"}

------------
 Larry Smith, High Density Copper Polyimide Interconnect,
 Proceedings of the 3rd International SAMPE Electronics
 Conference, p 939-947 (1989).  Published by SAMPE, Covina, CA,
 (1989)
 
 Dennis Herrell and Hassan Hashemi, Hybrid Wafer Scale
 Interconnections, Fronteirs in Computing Systems Research, vol 1,
 edited by S.K. Tewksbury, Plenum Press, NY, 1990.  p 93-128
-------
1. R. Wayne Johnson, Robert K.F. Teng and John W. Balde, Multichip Modules - 
	Systems Advantages, Major Constructions, and Materials Technologies. 
	New York:IEEE Press, 1991.

2. Joe Prang, "MCMs: The reality of today," Electronic Engineering, p. 33, 
	January 1992.

3. Keith Pitt, "Europe's MCM manufacturing capability - the now reality,"
	Electronic Engineering, p. 47 March 1992.

4. "Using memory as an active substrate for MCMs," Electronic Engineering, 
	p. 55, February 1992.

5. "Bonded wafers for high speed analogue ASICs," Electronics Engineering,
	p. 52, February 1992.

6. "High density interconnect for MCMs up to GHz," Electronics Engineering,
	p.50, February 1992.

7. R. W. Hartcourt et al, "Competing technologies of MCMs," Electronics 
	Engineering, p. 57, February 1992.

8. Michael Feldman, "Holographic optical interconnects for multichip modules,"
	Electronics Engineering, p. 49, September 1992.

9. "Three-D packaging for memories and systems," Electronic Engineering, 
	September 1992.

Besides these I have a few references on High Density Interconnects, Optical
Interconnects and Interconnection Issues which may be related with MCMs.
The ones I find pretty interesting are listed below:

10. Kobayashi M., et al., "Guided-Wave Optical Chip-to-Chip Interconnections,"
	Electronics Letters, Vol. 23, No.4, p. 143, February 1987.

11. Henry C., G. Blonder and R. Kazarinov, "Guided Waveguides on Silicon for 
	Hybrid Optical Packaging," Journal of Lightwave Technology, Vol. 7, 
	No. 10, October 1989.

12. Tewksbury S.K., L.A. Hornak and M. Hatamian, "High Tc Superconductors for 
	Digital System Interconnections," Solid-State Electronics, Vol. 32,
	No. 11, p. 947, 1989.

13. Hatamian M., L.A.Hornak, T.Little, S.K.Tewksbury, P.Franzon, "Fundamental
	Interconnection Issues," AT&T Technical Journal, Vol.66, Issue 4, 
	July/Aug 1987.

14. S.K.Tewksbury, "Interconnections within Microelectronic Systems,"
	Introduction Chapter in IEEE Press Book 1992. 
	*** TO BE PUBLISHED *** (Don't quote me on this one! :-> )

----------------------------------------------------------------
Chip-on-Flex
    Article in Surface Mount Technology, Vol. 5, No. 9,
    Sep 91 pp. 22-24, Available from Lake Publishing,
    IL 708-362-8711

    See also IPC-FA-251 "Assemble Guidelines for Flex Circuits" (850)_

    on COG and OVCC:
       Bob Lonerson
       General Dynamics, TX
       IPC Inorganic Base Substrates Subcommittee Chairman
       817 777 4000

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"Multichip Modules Spark Systems Debate" by Bernhard Levine
Electronic News,  Nov 16, 1992

"MCM Substrates Keep up", by Ashok Bindra,
Electronic Engineering Times, Nov 2, 1992
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