WAFER CHARGING SCHOOL

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1 total messages Started by Contin. Educ. in Eng. Wed, 31 Mar 1993 00:04

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Author: Contin. Educ. in Eng.
Date: Wed, 31 Mar 1993 00:04

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U.C. Berkeley
Continuing Education in Engineering
Presents a Short Course on:

Wafer Charging Effects in Ion Implantation Processing

June 10-11, 1993, Dallas/Ft. Worth Airport, Texas

Yield loss and reliability degredation related to wafer charging effects
during ion beam processing--during ion implantation in particular--is a major
technological risk for economically viable production of advanced IC devices. 
The purpose of this school is to draw together leading experts to present
tutorial lectures covering many aspects of this problem-from oxide wearout
phenomena to testing procedures, test structure design, beamline modeling and
characterization, and in-line production monitoring.  The school is being held
with the support and encouragement of the Working Group of the Sematech
Implantation Charging Project.

Lecturers: Jonathan England, Chenming Hu, Wes Lukaszek, Michael E. Mack,
Dieter Schroder, Frank Sinclair, T. C. Smith, and Michael C. Vella

Technical Advisors: Micheal Current and Larry Larsen

For more information contact:

Linda Reid or Mark Palermo
U.C. Berkeley Extension
Continuing Education in Engineering
2223 Fulton Street, Room 225
Berkeley, CA 94720
Tel:    (510) 642-4151
Fax:    (510) 643-8683
E-Mail: course@garnet.berkeley.edu

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