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Started by Kathie Nichols
Fri, 04 Jun 1993 17:33
Hot Interconnects Symposium, Aug 5-7, 1993
Author: Kathie Nichols
Date: Fri, 04 Jun 1993 17:33
Date: Fri, 04 Jun 1993 17:33
243 lines
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11209 bytes
Hot Interconnects '93 Symposium
Advance Program
Dinklespiel Hall
Stanford University
Palo Alto, CA
AUGUST 5-7, 1993
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The Hot Interconnects Symposium is a symposium on high performance buses,
multiprocessor interconnects, networks, and interfaces. Like Hot Chips,
it is intended for the engineering practitioner who is interested in real
solutions. Hot Interconnects is a platform for sharing knowledge and
solutions among the communities of architects and designers of single systems,
I/O subsystems, and networks of systems.
Sponsored by the Technical Committee on Microprocessors and Microcomputers
of the IEEE Computer Society.
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THURSDAY, AUGUST 5, 1993.
8:45-9:00 Welcome and Opening Remarks
Hasan AlKhatib, General Chair
Paul Borrill and Anoop Gupta, Program Co-Chairs
9:00-10:00 Keynote Speech:
"Interconnection Issues at Every Level in The Computer
Industry: Opinions & Futures"
Ed McCracken, President & CEO, Silicon Graphics
10:30-12:30 Advanced Bus Technology:
Session Chair: Paul Borrill, Sun Microsystems
"The Challenge Interconnect: Design of a 1.2Gbyte/sec
Coherent Multiprocessor Bus"
Mike Galles, SGI
"The HP suMMit Bus (PMB)"
Syrus Ziai and Cheryl Ranson, Hewlett Packard
"Electrical Design of the XDBus Using Low Voltage Swing CMOS
(GTL) in the Sparc Center 2000 Server"
Christopher Cheng and Leo Yuan, Sun Microsystems
"LTL - A High Performance CMOS Transceiver Technology"
Bob Lipp, Consultant
2:00-4:00 MP Interconnects
Session Chair: Anoop Gupta, Stanford
"The Meiko CS2 Interconnect"
Mark Homewood, Meiko
"The SCI NodeChip, a 500 MB/s Virtual Backplane Chip"
Hakon Bugge and Knut Alnes, Dolphin SCI Technology
"The S3.mp Interconnect System and TIC Chip"
Andreas Nowatzyk and Mike Parkin, Sun Microsystems
"A Pipelined Network Interface for a Parallel Computer"
Gunter Watzlawik and Franz Hutner, Siemens
4:15-5:45 Interconnect Design and Analysis
Session Chair: George Cox, Intel
"A Cost and Speed Model for k-ary n-cube Wormhole Routers"
Andrew Chien, Univ. of Illinois, Urbana-Champaign
"Hnet: A High-Performance Network Evaluation Testbed Preliminary
Results"
David Smitley, Frank Hady and Dan Burns,
Supercomputing Research Center
"Characterizing the Performance Space of Shared-Memory Machines
Using Micro-Benchmarks"
Rafael Saaverda, Stockton Gaines and Michael Carlton, USC
5:45-7:15 RECEPTION
7:15-9:00 PANEL: "Benchmarking Interconnects"
Moderator: George Cox, Intel
Panel Members: TBD
FRIDAY, AUGUST 6, 1993.
8:45-10:00 Keynote Debate moderated by Gordon Bell
"State of the ATM Art", Larry Roberts, NetExpress
"Is ATM the Only Answer to All Networks?", Danny Cohen, ISI
10:30-12:30 High Speed Networks
Session Chair: Van Jacobson, Lawrence Berkeley Laboratories
"The VIC (Virtual Interconnect with Control) Proposal for
Maximizing ATM Networks' Performance"
H.T. Kung, Harvard University
"ATM Over Fibre Channel: The ANSI Solution"
Terry Anderson, Ancor
"Atomic: From Interconnection Network to Local Area Network"
Bob Felderman, ISI
"Multiplexing on a High Speed Network"
Bryan Cook, IBM Poughkeepsie
2:00-3:00 Gigabit Links
Session Chair: Greg Chesson, SGI
"The HP 2-Gb/s G-Link Chipset"
Chu Yen, Hewlett Packard
"Integration of Multiple Bidirectional Point to Point Serial
Links in the Gigabits per second range"
Roland Marbot, Bull S.A.
3:15-4:15 New Developments
Session Chair: Deborah Estrin, USC and ISI
"Hybrid Access Systems to the Internet"
Howard Strachman, Hybrid Networks
"New Developments in the IEEE P1394 Serial Bus - Making it Fast,
Cheap, and Easy to Use"
Michael Teener, Apple Computer
4:30-6:30 Wireless Technologies
Session Chair: Kathleen Nichols, Apple Computer
"New Markets, a New FCC, and New Spectrum"
Jim Lovette, Apple Computer
"Key Issues in Wireless Networking"
Chih-Lin I AT&T Bell Laboratories
"CDMA Data Services"
Phil Karn, Qualcomm
"Mobile Internetworking"
Steve Deering, Xerox PARC
SATURDAY, AUGUST 7, 1993. (TUTORIALS)
8:30-12:00 Tutorial 1
Part I: Opto Electronics
Schelto van Doorn (Siemens), Ron Soderstrom (IBM)
and Gerry Rawls (Finisar).
Part II: Fibre Channel
Todd Sprenkle (Tandem)
8:30-12:00 Tutorial 2: MP Interconnects
Andrew Chien (University of Illinois)
1:30-5:00 Tutorial 3: ATM
Allan Fisher and Peter Steenkiste (CMU)
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Note that Hot Interconnects and Hot Chips are scheduled back-to-back (Hot Chips
is August 8-10).
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Organizing Committee
--------------------
General Chair: Hasan AlKhatib, Santa Clara University
Program Committee Co-Chairs: Paul Borrill, Sun Microsystems
Anoop Gupta, Stanford
Publicity: Kathleen Nichols, Apple Computer
Glen Langdon, University of California, Santa Cruz
Treasurer: Dima Khoury, TTC of Silicon Valley
Digest: Nam Ling, Santa Clara University
Registration: Qiang Li, Santa Clara University
Local Arrangements: Robert Stewart, Stewart Research
Program Committee
-----------------
Paul Borrill, Sun Microsystems
Anoop Gupta, Stanford University
Hasan AlKhatib, Santa Clara University
Dal Allen, ENDL
Gordon Bell
David Cheriton, Stanford University
Greg Chesson, Silicon Graphics
George Cox, Intel
Deborah Estrin, University of Southern California
Tom Knight, MIT
Kathleen Nichols, Apple Computer
Registration Information
------------------------
Fees for Technical Program:
before 7/12 after 7/12
IEEE-CS or ACM member $200 $250
Non-Member 250 315
Unemployed 180 230
Full-Time Student 100 120
Fees per half-day Tutorial:
before 7/12 after 7/12
IEEE-CS or ACM member $90 $105
Non-Member 110 135
Unemployed 70 85
Full-Time Student 20 30
Registration includes attendance, two lunches, parking, one copy of notes,
coffee breaks, and Thursday evening reception. On-site registration will start
at 7:30 am on Thursday, August 6, 1993.
Registration may be faxed or e-mailed if paid by credit card.
For more registration information contact Dr. Qiang Li at (408) 554-2730,
Fax (408) 554-5474, internet: qli@sunrise.scu.edu
Hot Interconnects '93 Registration Form
Name ____________________________________________________________________
Affiliation______________________________________________________________
Mailing Address__________________________________________________________
_________________________________________________________
Telephone No __________________________ Fax _____________________________
Check all that apply:
__Please don't include my name in any mailing list
__IEEE Member, membership number_________________
__ACM Member, membership number_________________
__Full-time student __Unemployed
__Please send me housing information
Amount Paid
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__Symposium Technical Program ___________
__Tutorial #1 or __Tutorial #2 ___________
__Tutorial #3 ___________
Amount enclosed: ___________
Payment Method:
__Check drawn on a U.S. Bank, __VISA, __MasterCharge
Make checks payable to: Hot Interconnects Symposium
Credit Card No.________________________ Expiration Date____________________
Name on Credit Card _______________________________________________________
Signature _________________________________________________________________
Mail to: Dr. Qiang Li, Dept. of Computer Engineering, Santa Clara University,
Santa Clara, CA 95053
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