Re: Spec for MAP & TOP

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Article #649

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#649

From: moto
Date: Mon, 08 Jun 1987 21:05

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MAP/TOP are part of quite a large effort to get different machines to "play"
together. Some of the emerging standards in the area are EDIF, IGES, VHDL.

They each serve as "application" layers in the MAP/TOP terminology, but the
function is to get ways to send designs. EDIF (the one I am most familiar
with) is intended to allow a user to transfer Electronic (IC/PCB) designs
between different CAD systems. Try comp.lsi for more info, or write the
EDIF Administration Office for mor info.

EDIF Administration office
2222 South Dobson Road, Bldg 5
Mesa, AZ 85203

Mike Waters
.

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References: <71@teletron.UUCP> <19266@ucbvax.BERKELEY.EDU> <2922@pyramid.UUCP>

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Relay-Version: version B 2.10 5/3/83; site utzoo.UUCP
Path: arc1-ca.pugleaf.net!utzoo!utgpu!water!watmath!clyde!cbosgd!ucbvax!ucbcad!moto
From: moto@ucbcad.UUCP
Newsgroups: comp.protocols.misc
Subject: Re: Spec for MAP & TOP
Message-ID: <1662@ucbcad.berkeley.edu>
Date: Mon, 8-Jun-87 17:05:16 EDT
Article-I.D.: ucbcad.1662
Posted: Mon Jun  8 17:05:16 1987
Date-Received: Thu, 11-Jun-87 00:59:56 EDT
References: <71@teletron.UUCP> <19266@ucbvax.BERKELEY.EDU> <2922@pyramid.UUCP>
Reply-To: moto@cad.Berkeley.EDU.UUCP (EDIF Committee)
Distribution: world
Organization: UC Berkeley, CAD group
Lines: 15
Keywords: EDIF, VLSI, IGES, standards, comp.lsi
Summary: Additional standards

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