🚀 go-pugleaf

In article <1ejb8lINNos7@chnews.intel.com>, tmcconne@sedona.intel.com (Tom McConnell~) writes:

| because it is running faster. For example, as I recall the first HP-PA
| (Precision Architecture) chip set was actually bonded to large copper
| "Finstrates" to dissapate heat because it ran so fast.

  That's not exactly a novel idea... GE was doing that back in the 60's
while we ere still in the computer business. And water cooling the back
of the substrate, too.

  There's a story that some algae formed in the cooling system, and one
of the employees decided s/he knew how to fix that (this was in Pheonix
AZ) and added some pool chemicals to the water. Unfortunately copper
sulphate and stuff made the water a nifty copper solvent and disolved
the chip from the backside.

  Right after that we sold the business.
-- 
bill davidsen, GE Corp. R&D Center; Box 8; Schenectady NY 12345
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