🚀 go-pugleaf

This message should clarify the true situation behind David May's presentation
of a T9000 alpha device to Parsytec at TAT '92 (Aachen).

The device in question was an open package containing a real T9000 alpha die
which was bonded out. It was the intention that this device should be used
for display purposes only and not intended to be plugged into a board,
and was presented to Parsytec who were the organisers of TAT '92 as David
May was unable to stay for the full duration of the conference.

We have been testing fully packaged T9000 alpha devices in our 
laboratories in Bristol as part of the normal product development cycle.
We have kept our transputer customers up to date with progress on the 
T9000 developments and have made provision for a special customer 
laboratory in Bristol where major customers can gain access to T9000 
alpha silicon and further their own product development.

The T9000 alpha silicon was intentionally produced without the data links.
The T9000 beta silicon which is going through the fab at the moment has 
all the functional blocks (including VCP and data links) of the T9000 
integrated (as defined in the technical disclosure of April 1991).

INMOS Limited

Steve Doyle, Software Marketing, INMOS Ltd   | Tel +44 454 616616
1000 Aztec West                              | 
Almondsbury                                  | UK: steved@inmos.co.uk
Bristol BS12 4SQ, UK                         | US: steved@inmos.com