🚀 go-pugleaf

Todd Krein of Dartmouth writes:


>Just a question... Have YOU ever tried to make anything TEMPEST class?
>It's a hell of lot harder than just a new enclosure, having tried to
>do something similar, and having talked w/ people who do it for a living.

That's what they'd LIKE you to think, at any rate.  I've seen at least
one set of blueprints for a tempested device (not a PC) which didn't
amount to anything more than placing steel shielding around the inside
of the casing for the device.  The device in question was more complex
than a PC or AT and the system worked.

Putting a PC in a metal box would definitely seal off emmisions when you think
about it.  The mystery to me is why anyone bothers with the other way of doing
it (i.e. redesigning boards like ITC does).  The pricing of such devices is
based on the same logic as the old German fairy-tale about the emporor and his
new suit.