Re: HP chip model planes

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#1573

From: Jasen Betts
Date: Tue, 27 Jan 2009 10:44

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On 2009-01-26, miso@sushi.com <miso@sushi.com> wrote:
> On Jan 26, 9:34 am, Joerg <notthisjoerg...@removethispacbell.net>

> Of course, the side braze package screams "take off the lid and take a
> look at me." You want to make life at least a little bit harder for
> the chip copiers. Worse yet, it makes it easy for the competition to
> probe your chip. [You pull the probe station wafer chuck and slide in
> a card with zif socket. It works quite well. Laser off the vapox.]

I did that to some regular cerdips as a kid so I could stick them
under my toy microscope. if you whack 'em right the top comes away.

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From: Jasen Betts <jasen@xnet.co.nz>
Newsgroups: sci.electronics.design,aus.electronics
Subject: Re: HP chip model planes
Date: 27 Jan 2009 10:44:07 GMT
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References: <61465472-06b3-49f3-9bc1-dd030e3e1fa7@n33g2000pri.googlegroups.com>
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