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Article #10184Prototyping with surface-mount IC's
From: Robert Kelley
Date: Fri, 15 Feb 1991 17:43
Date: Fri, 15 Feb 1991 17:43
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Well, I've got this nice 68340FE16 sample in a ceramic surface mount package with 144 leads on 0.050 centers. I want to experiment with it. What viable approaches exist for prototyping and experimentation, as opposed to production, with chips in packages like this? Do I have to prepare a surface-mount PC board for it? Robert Kelley rjk@sequent.com
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arc1-ca.pugleaf.net!utzoo!utgpu!news-server.csri.toronto.edu!cs.utexas.edu!sdd.hp.com!spool.mu.edu!snorkelwacker.mit.edu!mit-eddie!uw-beaver!zephyr.ens.tek.com!tektronix!sequent!rjkShow Full Headers
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Path: arc1-ca.pugleaf.net!utzoo!utgpu!news-server.csri.toronto.edu!cs.utexas.edu!sdd.hp.com!spool.mu.edu!snorkelwacker.mit.edu!mit-eddie!uw-beaver!zephyr.ens.tek.com!tektronix!sequent!rjk From: rjk@sequent.com (Robert Kelley) Newsgroups: sci.electronics Subject: Prototyping with surface-mount IC's Keywords: FE package Message-ID: <53294@sequent.UUCP> Date: 15 Feb 91 17:43:21 GMT Sender: rjk@sequent.UUCP Organization: Sequent Computer Systems, Inc. Lines: 8