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Article #11521

Re: TEC-200 film

#11521
From: Kevin Doherty
Date: Tue, 10 Nov 1992 13:54
33 lines
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ajackson@ernie.Princeton.EDU (Andrew William Jackson) writes:

>TEC-200 film

>Has anyone tried this stuff?  Supposedly you photocopy your
>PCB pattern onto it with a normal photocopier and then iron
>it onto a blank copper board, peel off the plastic substrate
>leaving the pattern behind - then you etch it.  Sounds like
>a great way to make boards without the hassle of using photo
>resist.

  It's my favorite way to make PC boards, although there are a
few tricks to it.

  First, an iron doesen't do the job very well.  Uneven pressure
with the iron causes some of the lines to smear.  I sandwich the
film, the copperclad, and a piece of heat resistant foam between
two metal plates, then heat the sandwich.  This keeps the pressure
uniform over a wide area.

  Another problem is with the laser printers used to put the art on
the film.  Thin traces are fine, but large black areas tend to be
a little patchy and grainy.  If it isn't critical, I just ignore the
problem - some of the copper on the ground plane gets etched.  If I
care, I just lay down another layer of toner on top of the first.

  I've made 2 sided boards up to 6" by 9" that have come out 
beautifully.  If a circuit has more than five or six components,
these days I make a PC board as a matter of course.

  I understand, though, that this stuff has several competitors
now - particularly paper based systems.  Does anyone have data on
these?
Technical Details
Message-ID: <BxI6Ms.6pn@melpar>
Path: arc1-ca.pugleaf.net!sparky!uunet!melpar!doherty
References: <1992Nov10.014707.29328@Princeton.EDU>

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Newsgroups: sci.electronics
Path: arc1-ca.pugleaf.net!sparky!uunet!melpar!doherty
From: doherty@melpar (Kevin Doherty)
Subject: Re: TEC-200 film
Organization: E-Systems, Melpar Division
Date: Tue, 10 Nov 1992 13:54:26 GMT
Message-ID: <BxI6Ms.6pn@melpar>
References: <1992Nov10.014707.29328@Princeton.EDU>
Lines: 34