Re: Heat sink

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Article #14745

#14745

From: John Whitmore
Date: Wed, 18 Nov 1992 22:44

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In article <1e8p9mINNa4o@iskut.ucs.ubc.ca> ivar@unixg.ubc.ca (ivar jonsson) writes:
>I am looking for S/W packages that are capable to model and simulate
>a HEAT SINK .  My objective is to optimize the haet removal from a high
>powered circuit.  Any suggestions will be helpfull.

	How about SPICE?  You just make a subcircuit for
the heat (heat capacity = capacitor, heat source= current source,
temperature= voltage on capacitor, heat dissipation = voltage-dependent
current source) and let SPICE solve it.

	This will require extensive information on air flow,
temperature, and the characteristics of the heat sinks.  Usually
these are specified only as limits, not as accurate values,
so some experimentation will be required in any case.

	John Whitmore

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References: <msolomon-051192173749@mac61177.mitre.org> <1992Nov16.162241.2928@wam.umd.edu> <1e8p9mINNa4o@iskut.ucs.ubc.ca>

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Newsgroups: sci.electronics
Path: arc1-ca.pugleaf.net!sparky!uunet!sun-barr!ames!saimiri.primate.wisc.edu!usenet.coe.montana.edu!news.u.washington.edu!carson.u.washington.edu!whit
From: whit@carson.u.washington.edu (John Whitmore)
Subject: Re: Heat sink
Message-ID: <1992Nov18.224431.4167@u.washington.edu>
Keywords: Modelling
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Organization: University of Washington, Seattle
References: <msolomon-051192173749@mac61177.mitre.org> <1992Nov16.162241.2928@wam.umd.edu> <1e8p9mINNa4o@iskut.ucs.ubc.ca>
Date: Wed, 18 Nov 1992 22:44:31 GMT
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