Article View: sci.electronics
Article #15753Re: "The Glob" Atari 2600 processors ???
From: Brad Houser
Date: Thu, 17 Dec 1992 22:48
Date: Thu, 17 Dec 1992 22:48
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The "Glob" is called "Chip on Board". It is an inexpensive way to package the silicon chip. The chip itelf is glued to the PCB, the bonding pads of the chip are wired to the traces using an automatic wire bonder, and then a hot glob of melted plastic is placed (globbed?) onto the chip. Why isn't this done more often? One reason is reliability. It is likely to be less reliable than conventional plastic packages. If it fails you basically replace the whole board. In a higher priced system, you wouldn't take a chance of hermetically sealing the processor chip to the board much like you wouldn't wave solder a 486. -- [Brad Houser Home of Pentium (tm) ] [ bhouser@sc9.intel.com ] [+1-408-765-0494 Woof!]
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Path: arc1-ca.pugleaf.net!sparky!uunet!spool.mu.edu!olivea!inews.Intel.COM!sc9!bhouser From: bhouser@sc9.intel.com (Brad Houser) Newsgroups: sci.electronics Subject: Re: "The Glob" Atari 2600 processors ??? Message-ID: <BzFE1K.369@inews.Intel.COM> Date: 17 Dec 92 22:48:54 GMT References: <1gp41fINN6h1@usenet.INS.CWRU.Edu> Sender: news@inews.Intel.COM (USENET News System) Reply-To: bhouser@sc9.intel.com Organization: Intel Corporation, California Technology Development Lines: 16 Nntp-Posting-Host: libra