Article View: sci.electronics
Article #16795Re: Heat gun pcb cannabalization
From: Robert Wiegand
Date: Tue, 26 Jan 1993 15:00
Date: Tue, 26 Jan 1993 15:00
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pieterh@sci.kun.nl (Peter Herweijer) writes: >In <651@rins.ryukoku.ac.jp> will@rins.ryukoku.ac.jp (William Reiken) writes: >>In article <1jebh6INNie7@clover.csv.warwick.ac.uk>, cstadbg@csv.warwick.ac.uk (Mr M J Brown) writes: >>>only if you heat ALL the legs. I have also managed to strip boards previously >>>to getting the Black and Decker with a butane blowtorch. It is a) a question >>>of practice, and b) remembering it is the PARTS you want to save and not the >>>board they are on. This will be pretty much damaged by large scale desoldering >>> >> I was told that microchips will be damaged if you use this approach. >>Does it really matter? >> >Using the very same method, I have successfully stripped a bunch of >computer boards of their components, including Z80 CPU's and 8255 PIO's. >Everything worked fine. I did it with a friend, he heated the PCB, I >pulled out the components and immediately threw them in a bucket of >water to cool them off, but I don't know if that's necessary. One tip >though: do it outside. The fumes stink and are probably not healthy. Actually, I would expect that throwing the parts into cold water could possibly damage them. The sudden temp. change could crack the die or break one of the lead bonds. -- ------------------------------------------------------------------------------ Robert Wiegand - Motorola Inc. motcid!wiegand@uunet.uu.net uunet!motcid!wiegand Disclamer: I didn't do it - I was somewhere else at the time.
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Newsgroups: sci.electronics Path: arc1-ca.pugleaf.net!sparky!uunet!panther!mothost!white!rtsg.mot.com!lido16!wiegand From: wiegand@rtsg.mot.com (Robert Wiegand) Subject: Re: Heat gun pcb cannabalization Message-ID: <wiegand.728060445@lido16> Keywords: Heat gun, charring, lack_of_skill, try_again_maybe Sender: news@rtsg.mot.com Nntp-Posting-Host: lido16 Reply-To: motcid!wiegand@uunet.uu.net Organization: Motorola Inc., Cellular Infrastructure Group References: <15JAN199321554385@utarlg.uta.edu> <1jebh6INNie7@clover.csv.warwick.ac.uk> <651@rins.ryukoku.ac.jp> <C1EuMK.49w@sci.kun.nl> Date: Tue, 26 Jan 1993 15:00:45 GMT Lines: 31