Junction to Case Thermal Resistance Database

Article View: sci.electronics

Article #16877

#16877

From: Tony Wong
Date: Tue, 26 Jan 1993 21:04

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Greetings,

I am in search of databases with junction to case thermal resistance
values (Theta-jc) for both common and exotic electronic components 
currently in use.  I am interested in values for a variety of packages,
including DIPs, circular can packages (the TO-X series), MPAKs, QPAKs,
LCCs, etc.

Please email me at ktwong@igate1.hac.com if you have any or can suggest
where to look for these databases.

Thank You
Anthony Wong

-- 
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Anthony K.T. Wong, Hughes Missile Systems Company, ktwong@igate1.hac.com  |  
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(Opinions expressed are mine, not my employers')

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Path: arc1-ca.pugleaf.net!sparky!uunet!ulowell!news.bbn.com!usc!hacgate!daops6!tony
From: tony@daops6.scg.hac.com (Tony Wong)
Newsgroups: sci.electronics
Subject: Junction to Case Thermal Resistance Database
Keywords: Theta-jc, Thermal Resistance
Message-ID: <24870@hacgate.SCG.HAC.COM>
Date: 26 Jan 93 21:04:56 GMT
Sender: news@hacgate.SCG.HAC.COM
Reply-To: ktwong@igate1.hac.com (Anthony Wong)
Organization: Hughes Aircraft Co., Tucson, AZ
Lines: 20