Article View: sci.electronics
Article #17001High Density PCB Connectors
From: Randy Casciola
Date: Tue, 12 Jan 1993 00:07
Date: Tue, 12 Jan 1993 00:07
70 lines
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2807 bytes
Folks,
I am looking for high density board stacking connectors.
All of my boards will be identical and be about 2.5 inches
square. The idea is to pass the control, data, and address
busses from one board to the next, indefinitely (at least
from a mechanical standpoint). Two possible ways of doing
this are:
1. Using through-hole technology, where the pins from the
receptacle on the top of the board go through the holes
in the board and are soldered to the bottom; the pins
continue and are used to mate with the receptacle on the
top of the next board. And so on. Kind of like the
picture below (Side View).
_____
____BOARD______________|___|_<-- HEADER
| |
| | <-- PINS
_____
_______________________|___|_
| |
| |
2. Doing a similar thing, but with surface mount where an
SMT receptacle is on the top, and an SMT header on the
bottom, and connections are made through the board using
vias.
______
________________|____|_
|__|
______
________________|____|_
|__|
The problem with the first method is that I need two rows of
40 pins/row. Since the connector has to be less than 2.5 inches
wide, I need .050" pins and I haven't seen anything designed to
be stacked like this with .050" centers.
The problem with the second is that I need twice as many connectors,
and allignment problems may crop up. I found some parts from
Samtec that I could use, but they don't provide enough space between
boards.
So, if anyone knows of a connector I can use, or a company that I
could call to get a catalog, I would appreciate hearing from you.
Or, if you have a better idea altogether of how to stack these I would
like to hear it. It doesn't matter whether you post to this group, or
mail me at randy@cmu.edu
I already have catalogs from:
Samtec
Aries
Mil-Max Preci Dip
Hirose
Robinson Nugent
Hypertronics
Thanks in advance,
Randy Casciola
Research Engineer
The Robotics Institute
Carnegie Mellon
Pittsburgh, Pa 15213
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<C0psD4.62v.2@cs.cmu.edu>Path:
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Path: arc1-ca.pugleaf.net!sparky!uunet!zaphod.mps.ohio-state.edu!uwm.edu!ogicse!das-news.harvard.edu!cantaloupe.srv.cs.cmu.edu!g3.ius.cs.cmu.edu!rwc From: rwc@ius4.ius.cs.cmu.edu (Randy Casciola) Newsgroups: sci.electronics Subject: High Density PCB Connectors Message-ID: <C0psD4.62v.2@cs.cmu.edu> Date: 12 Jan 93 00:07:52 GMT Article-I.D.: cs.C0psD4.62v.2 Sender: rwc@g3.ius.cs.cmu.edu (Randy Casciola) Organization: CMU Vision and Autonomous Systems Lines: 70 Nntp-Posting-Host: g3.ius.cs.cmu.edu