🚀 go-pugleaf

Several heavilly funded companies (eg Trilogy) have attempted to
do wafer scale integration, and failed due to technical problems.
It isn't easy - remember that your "arbitrary interconnect" to
connect the good processor dies has to have its own redundancy,
and that for large N, interconnects are more complicated than
processors anyway.  There was an artical in Electronics or digital
design or some such reporting on one of the few companies left,
who have succedded in making memory chips out of large pieces
of wafers - unfortunately, the total capacity is less than some
memory chips produced by  more conventional means.

BillW