Article View: sci.electronics
Article #18415Re: Wire-wrap Question
From: dale chayes
Date: Sun, 17 Jan 1988 01:25
Date: Sun, 17 Jan 1988 01:25
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In article <5256@burdvax.PRC.Unisys.COM>, coltoff@PRC.Unisys.COM (Joel Coltoff) writes: > 3M make a prototyping system that is much better than wire wrap. > I don't know what it is called and the one I use is in another Its called Scotchflex. We use it extensively. As long as you are careful with the boards (its not too hard to pull a wire out or press an extra one in) its great. It allows much thinner proto-type boards, and its real quick to move a wire or add one in the debugging process. -- Dale Chayes Lamont-Doherty Geological Observatory of Columbia University usmail: Route 9W, Palisades, N.Y. 10964 voice: (914) 359-2900 extension 434 fax: (914) 359-6817 usnet: ...philabs!lamont!dale
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Path: arc1-ca.pugleaf.net!utzoo!mnetor!uunet!lll-winken!lll-lcc!ames!amdahl!pyramid!prls!philabs!lamont!dale From: dale@lamont.Columbia.edu (dale chayes) Newsgroups: sci.electronics Subject: Re: Wire-wrap Question Message-ID: <289@lamont.Columbia.edu> Date: 17 Jan 88 01:25:10 GMT References: <7110004@hpcupt1.HP.COM> <5256@burdvax.PRC.Unisys.COM> Organization: Lamont-Doherty Geological Observatory N.Y. Lines: 15 Summary: The 3M product is SCOTCHFLEX