Article View: sci.electronics
Article #19090Encapsulation in plastic for ruggedization
From: John B. Nagle
Date: Mon, 25 Apr 1988 15:52
Date: Mon, 25 Apr 1988 15:52
11 lines
930 bytes
930 bytes
I'm interested in ruggedization treatments for small PC boards.
The first approach is conformal coatings. I've tried Final-Kote,
but all I get is a thin tacky film that takes about two days to dry.
What are some good alternatives, preferably ones that won't affect
tuned RF circuits? I'd like a thick, clear coat covering the components.
There are also plastics for fully encapsulating a circuit in a
solid block. Any suggestions here?
John Nagle
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arc1-ca.pugleaf.net!utzoo!mnetor!uunet!husc6!bloom-beacon!tut.cis.ohio-state.edu!uwmcsd1!ig!agate!ucbvax!decwrl!labrea!glacier!jbnShow Full Headers
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Path: arc1-ca.pugleaf.net!utzoo!mnetor!uunet!husc6!bloom-beacon!tut.cis.ohio-state.edu!uwmcsd1!ig!agate!ucbvax!decwrl!labrea!glacier!jbn From: jbn@glacier.STANFORD.EDU (John B. Nagle) Newsgroups: sci.electronics,rec.ham-radio Subject: Encapsulation in plastic for ruggedization Message-ID: <17420@glacier.STANFORD.EDU> Date: 25 Apr 88 15:52:15 GMT Organization: Stanford University Lines: 11 Keywords: conformal coating encapsulation plastic ruggedization