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Article #19090

Encapsulation in plastic for ruggedization

#19090
From: John B. Nagle
Date: Mon, 25 Apr 1988 15:52
11 lines
930 bytes
      I'm interested in ruggedization treatments for small PC boards.
The first approach is conformal coatings.  I've tried Final-Kote,
but all I get is a thin tacky film that takes about two days to dry.
What are some good alternatives, preferably ones that won't affect
tuned RF circuits?  I'd like a thick, clear coat covering the components.

      There are also plastics for fully encapsulating a circuit in a
solid block.  Any suggestions here?  

					John Nagle
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Path: arc1-ca.pugleaf.net!utzoo!mnetor!uunet!husc6!bloom-beacon!tut.cis.ohio-state.edu!uwmcsd1!ig!agate!ucbvax!decwrl!labrea!glacier!jbn
From: jbn@glacier.STANFORD.EDU (John B. Nagle)
Newsgroups: sci.electronics,rec.ham-radio
Subject: Encapsulation in plastic for ruggedization
Message-ID: <17420@glacier.STANFORD.EDU>
Date: 25 Apr 88 15:52:15 GMT
Organization: Stanford University
Lines: 11
Keywords: conformal coating encapsulation plastic ruggedization