Article View: sci.electronics
Article #19092Re: Encapsulation in plastic for ruggedization
From: Kevin Tubbs
Date: Tue, 26 Apr 1988 03:17
Date: Tue, 26 Apr 1988 03:17
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In article <17420@glacier.STANFORD.EDU> jbn@glacier.STANFORD.EDU (John B. Nagle) writes:
> I'm interested in ruggedization treatments for small PC boards.
>What are some good alternatives, preferably ones that won't affect
>tuned RF circuits? I'd like a thick, clear coat covering the components.
The guys in my research group that build payloads for rocket experiments
use clear Dow/Corning RTV (expensive). I think they either dip the boards,
or pour it on, then pour off the excess. Makes a nice smooth coating.
--
Kevin Tubbs, 5152 Upson, Cornell University, Ithaca NY, 14853 (607) 255-8703
kevin@calvin.ee.cornell.edu {uunet,rochester}!cornell!calvin!kevin
"If you took all the CP/M users in the world, and laid them end-
to-end at the equator, it would be a good thing."
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Path: arc1-ca.pugleaf.net!utzoo!mnetor!uunet!lll-winken!lll-tis!ames!ll-xn!mit-eddie!uw-beaver!cornell!calvin!kevin From: kevin@calvin.EE.CORNELL.EDU (Kevin Tubbs) Newsgroups: sci.electronics,rec.ham-radio Subject: Re: Encapsulation in plastic for ruggedization Message-ID: <343@calvin.EE.CORNELL.EDU> Date: 26 Apr 88 03:17:51 GMT References: <17420@glacier.STANFORD.EDU> Reply-To: kevin@calvin.ee.cornell.edu.UUCP (Kevin Tubbs) Organization: Cornell Space Plasma Physics Group Lines: 13