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Article #19488

Re: SPICE

#19488
From: barry ornitz
Date: Thu, 21 Jul 1988 13:46
33 lines
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There is a version of SPICE (2g6, I think) available from the Digital Equip-
ment Users Group, DECUS.  I have used this version extensively and found it
to be relatively bug-free.  There are newer versions available from the
University of California, Berkeley, for VAXen and PC's for basically a small
distribution cost.  I have not used these, but I have heard numerous complaints
about bugs in these versions.  The newsgroup dealing with LSI design would be
a good place to ask about these newer versions.

I am now using the version by INTUSOFT for use with PC's.  Simulation speed is
slow as expected, but the schematic capture and graphics post processor are
quite useful, as are their component libraries.  You can generate your SPICE
input file using this software and upload it to a VAX for the simulation; then
you can download the SPICE output file back to your PC and use the INTUSOFT
graphics package to display your results.

There are several other implementations of SPICE for PC's out there.  Before
buying one, you should get some experience on your VAX.

While writing this note, I remembered where I mislaid my VAX software source
book.  DEC has two entries on SPICE, one very high priced and the other from
DECUS.  As for the DECUS version, call Cathy Hatch at DECUS at 617/480-3419
for more details.  Good luck on this effort - I think you will find SPICE
very useful.
                                          73  Barry  WA4VZQ
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|  ___  ________  |
| |  / /        | |  Dr. Barry L. Ornitz   UUCP:...!rochester!kodak!ornitz
| | / /         | |  Eastman Kodak Company
| |< < K O D A K| |  Eastman Chemicals Division Research Laboratories
| | \ \         | |  P. O. Box 1972
| |__\ \________| |  Kingsport, TN  37662       615/229-4904
|                 |
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Path: arc1-ca.pugleaf.net!utzoo!attcan!uunet!husc6!mailrus!cornell!rochester!kodak!ornitz
From: ornitz@kodak.UUCP (barry ornitz)
Newsgroups: sci.electronics
Subject: Re: SPICE
Summary: Availability
Keywords: SPICE, simulation, DEC, DECUS
Message-ID: <1334@kodak.UUCP>
Date: 21 Jul 88 13:46:11 GMT
References: <636@eplunix.UUCP>
Reply-To: ornitz@kodak.UUCP (barry ornitz)
Followup-To: sci.electronics
Organization: Eastman Kodak Co, Rochester, NY
Lines: 33