HELP Needed with Wire Bonding to PCB's

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Article #2638

#2638

From: srgpgct
Date: Thu, 09 Apr 1992 06:00

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We have an application where we are trying to make wire bonds from dice
to a copper-clad PCB. We have a standard thermosonic ball / wedge bonder,
which we normally use to bond dice into packages, and hybrid circuits.
We tried bonding onto a PCB, but without much success. One suggestion is that
the copper is oxidising, as we don't have an inert blanket gas.
If anyone has done this, or knows how, I  would really appreciate hearing
how!  Many Thanks,

Gary Turner                                         
                                                   
DSIR Industrial Development,     Fax: +64-4-569-0117
P.O.Box 31313,                  Work: +64-4-569-0220
Lower Hutt,  ( NZST : +12 )     Home: +64-4-475-8844
New Zealand.      Internet: srgpgct@grv.dsir.govt.nz

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Newsgroups: sci.electronics
Subject: HELP Needed with Wire Bonding to PCB's
Message-ID: <1992Apr9.180020.16713@grace.dsir.govt.nz>
From: srgpgct@grace.dsir.govt.nz
Date: 9 Apr 92 18:00:20 +1200
Organization: DSIR, Gracefield, New Zealand
Lines: 14