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In article <1992Apr12.023534.6081@aplcen.apl.jhu.edu> kmd@aplcen.apl.jhu.edu (Kevin Doherty) writes:

>  I gather that there are several 'electroless' copper plating techniques
>out there; just drop an object in the bath, and it gets covered with

>  Is this a suitable technique for through plating?  If so, how do I do
>it?  If not, what should I do instead?

Yes it is, with some additions. First use the electroless bath on the
board. That will give you a very thin coating, too thin for any
practical use. Thus, the layer has to be thickened. That is done using
electroplating on the board after the electroless process. This way,
you don't even need any PCB-board at all. Just a plate of plastic, on
which you can deposit the copper yourself, as thick as you need up to
several millimeters (at which point you have no holes left anymore
;-). ABS plastic is particularly useful, since it can be easily etched
ensuring a firm adherence of the copper.

You can find electroless and electrolytic baths in any chemical
encyclopedia and references therein. Check the Kirk & Othmer's
"Encyclopaedia of Chemical Technology" or the Ullmann's "Enzyklopaedie
der Technischen Chemie". There are also books on electro- and
electroless plating. I have a good one ("Galvanotechnik"), the author
escapes my memory.

>  Thanks!

ArNO
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