Article View: sci.electronics
Article #3492Re: ground bounce
From: Phil Ngai
Date: Mon, 23 Oct 1989 21:18
Date: Mon, 23 Oct 1989 21:18
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In article <809@anasaz.UUCP> john@anasaz.UUCP (John Moore) writes:
|>In article <27746@amdcad.AMD.COM> phil@diablo.amd.com (Phil Ngai) writes:
|>AMD has an application brief titled "Minimization of Ground Bounce
|
|Presumably AMD was thus well prepared for the earthquake! ;>)
According to AMD's PR person, semiconductor fabrication is very
sensitive to vibrations and the modifications made to the buildings to
control vibrations also made them strong enough to handle the
earthquake and there was no damage.
I don't think I'll comment on this beyond saying that I am not
speaking for the company.
--
Phil Ngai, phil@diablo.amd.com {uunet,decwrl,ucbvax}!amdcad!phil
Just say NO to the "War on Drugs".
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Path: arc1-ca.pugleaf.net!utzoo!utgpu!jarvis.csri.toronto.edu!rutgers!tut.cis.ohio-state.edu!gem.mps.ohio-state.edu!apple!bionet!ames!amdahl!amdcad!diablo!phil From: phil@diablo.amd.com (Phil Ngai) Newsgroups: sci.electronics Subject: Re: ground bounce Message-ID: <27856@amdcad.AMD.COM> Date: 23 Oct 89 21:18:10 GMT References: <27746@amdcad.AMD.COM> <29700@obiwan.mips.COM> <809@anasaz.UUCP> Sender: news@amdcad.AMD.COM Reply-To: phil@diablo.AMD.COM (Phil Ngai) Organization: Advanced Micro Devices, Inc. Sunnyvale CA Lines: 18