Article View: sci.electronics
Article #430PC board manufacture: my technique
From: pvr
Date: Tue, 03 Nov 1992 18:41
Date: Tue, 03 Nov 1992 18:41
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3931 bytes
I have followed the past thread on making pc boards and
have tried all of them except for plotting with ink on copper
directly. I don't have a suitable plotter. I have tried
transparency film and release paper with only mediocre results.
The best luck that I am having now uses ordinary copier
paper. I print on the paper at normal density. I am using a
"super black" toner cartridge from Black Lightning. I don't think
that this is necessary because I tried the output from another
printer with an ordinary cartridge and got equivalent results.
All of the following technique is with the super black toner.
I prepare the copper surface by sanding it with number 320
wet sanding sand paper. I do the sanding dry (don't know if this
matters). I sand in small circles so the scratches go in all
directions so the adhesion will not have a perfered axis.
I iron the paper onto the copper with the iron at 170 degrees C,
that is the highest temperature on my iron. The fuser
in my laser printers (LaserJet II and III) runs at 160 degrees C.
I iron for about 30 seconds on my counter top with a paper
towel between the board and counter top. This provides
insulation and a slight springiness to the board as I iron.
I iron enough to insure that every part of the paper is heavly
pressed onto the board.
Immediately after ironing I place a wet (dripping)
paper towel on the ironed on paper and press the iron onto
the wet towel. This drives steam into the paper. Without
this step the paper will shrink and pull the toner off the
copper. The steam causes the paper to swell up and relieve
the strain. The iron should be placed on the towel for
a split second or the paper will dry out. I then soak
the paper with dripping water and let it sit for about 5
minutes.
The paper should be completely soaked and swelling
between traces. I then rub the paper with my fingers under
running water. The paper will begin to ball up and come off
in layers. I rub it until I get as much off as I can. At
this point the traces should be well attached to the copper and
not at risk at coming off.
You will find that all the toner has a paper fibers
imbeded into its surface. This is not a problem in most cases.
The problen arises when the fibers bridge the gap between
traces or pads. To solve this I scrub the board with a brass
brush. This brush is like a tooth brush with bristles made
of fine brass wire. The brush will break the fibers that
bridge gaps between toner areas. Do this while the board
is wet. Let the board dry and inspect all the toner
for fibers that would prevent proper etching. Pick any
remaining fibers away with an exacto knife.
While I etch the board, I periodically scrub the surface
with a real tooth brush to insure that the fibers are not blocking
etchant access to any portion of the exposed copper. Do not use
the brass brush in the etchant as it will be desolved itself.
I have made a number of small boards up to 2 by 4.5 inches
using this process and some with very fine traces and spacings.
I complete the etching of one side before I apply the toner
to the other side. I don't know it this process will scale up to
larger sizes well. It seems to me that the steam step is
particularly important. Before I did this traces would pull off at
the edges of the board as the board cooled.
Good luck
--
>>>>>>>>>>>> Peter Reilley ..... pvr@wiis.wang.com ..... KA1LAT <<<<<<<<<<<<<
Well, that about says it.
Technical Details
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Newsgroups: sci.electronics Path: arc1-ca.pugleaf.net!sparky!uunet!das.wang.com!wang!pvr From: pvr@wang.com () Subject: PC board manufacture: my technique Organization: Wang Labs, Lowell MA, USA Date: Tue, 3 Nov 1992 18:41:34 GMT Message-ID: <Bx5L9B.EJ8@wang.com> Sender: news@wang.com Nntp-Posting-Host: preilley.wiis.wang.com Lines: 72