Article View: sci.electronics
Article #577Re: Surface-mount chips
From: Larry Lippman
Date: Sun, 18 Jun 1989 16:28
Date: Sun, 18 Jun 1989 16:28
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1759 bytes
In article <19590@cup.portal.com>, mmm@cup.portal.com (Mark Robert Thorson) writes:
> [Discussion about replacing SMD deleted]
> ...
> Unless you have a soldering iron with a very fine tip, you may have trouble
> making the connections to the pads on the board. What I do in this situation
> is to get out my old soldering GUN, wrap about 4 or 5 turns of heavy copper
> wire around the tip, then bend the end of the wire forward to form a tiny
> tip. The tiny tip should be no more than about 1/2 inch from the regular
> tip of the gun, because otherwise you lose too much heat to melt solder.
I'm impressed.
You must have both an awfully steady and strong hand in order to
position a couple-pound soldering gun (even with a "fine tip") well enough
to solder wire to SMD pads!
On a more serious note, I would be rather concerned about stray
leakage currents from the soldering iron destroying CMOS circuits, since
I don't know of any soldering gun which has grounded elements.
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Path: arc1-ca.pugleaf.net!utzoo!utgpu!jarvis.csri.toronto.edu!rutgers!sunybcs!kitty!larry From: larry@kitty.UUCP (Larry Lippman) Newsgroups: sci.electronics Subject: Re: Surface-mount chips Summary: Strong and steady hands... Message-ID: <3243@kitty.UUCP> Date: 18 Jun 89 16:28:17 GMT References: <465@sdcc15.ucsd.edu> <25991@amdcad.AMD.COM> <19590@cup.portal.com> Distribution: usa Organization: Recognition Research Corp., Clarence, NY Lines: 24