Article View: sci.electronics
Article #8762UV glue poser
From: J Gourlay
Date: Wed, 05 Dec 1990 20:34
Date: Wed, 05 Dec 1990 20:34
12 lines
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947 bytes
I was wondering if anyone has come across a particularly viscous,UV
curing glue for microelectronic chip packaging(glass to silicon).
Any info would be gratefully received as we are having great problems
with our current techniques.
James Gourlay
Dept.of Physics
University of Edinburgh
Mayfield Road
Edinburgh
Eh9 3JZ.
U.K.
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arc1-ca.pugleaf.net!utzoo!utgpu!news-server.csri.toronto.edu!cs.utexas.edu!samsung!zaphod.mps.ohio-state.edu!wuarchive!mit-eddie!bloom-beacon!eru!hagbard!sunic!mcsun!ukc!edcastle!jg90Show Full Headers
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Path: arc1-ca.pugleaf.net!utzoo!utgpu!news-server.csri.toronto.edu!cs.utexas.edu!samsung!zaphod.mps.ohio-state.edu!wuarchive!mit-eddie!bloom-beacon!eru!hagbard!sunic!mcsun!ukc!edcastle!jg90 From: jg90@castle.ed.ac.uk (J Gourlay) Newsgroups: sci.electronics Subject: UV glue poser Message-ID: <7459@castle.ed.ac.uk> Date: 5 Dec 90 20:34:06 GMT Sender: jg90@castle.ed.ac.uk Organization: Edinburgh University Computing Service Lines: 12