Article View: sci.electronics
Article #922Re: Which is a better conductor: gold or silver?
From: Vaso Bovan
Date: Sat, 22 Jul 1989 08:55
Date: Sat, 22 Jul 1989 08:55
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In article <1378@nosc.NOSC.MIL> koziarz@halibut.nosc.mil.UUCP (Walter A. Koziarz) writes: >Gee, I thought the problem with plastic packages from military standpoint >was hermeticity. But, I only share office space with those who write the >specs. Agreed on the gold-wire vs aluminum wire portion. > >Walt K. Does the military still consider that ceramic/cerdip packages also have better thermal characteristics, in general. Even with copper lead frames, a problem with plastic packages is that the plastic is (relatively) a heat insulator, so that little heat gets out the top of the package. Most heat must flow through the leads. Thus, fan cooling is less effective with plastic packages. With this in mind, many companies have a rule of thumb which says that junction temperatures determine whether plastic or ceramic/cerdip is used. My rule of thumb is 125C worst case junction temperature, well below the glass transition temperature. Is this a reasonable rule of thumb in ROME's opinion ?
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Path: arc1-ca.pugleaf.net!utzoo!attcan!utgpu!jarvis.csri.toronto.edu!rutgers!apple!vsi1!daver!mips!vaso From: vaso@mips.COM (Vaso Bovan) Newsgroups: sci.electronics Subject: Re: Which is a better conductor: gold or silver? Message-ID: <23818@quacky.mips.COM> Date: 22 Jul 89 08:55:01 GMT References: <14172@swan.ulowell.edu> <19729@louie.udel.EDU> <20483@cup.portal.com> <1378@nosc.NOSC.MIL> Reply-To: vaso@mips.COM (Vaso Bovan) Organization: MIPS Computer Systems, Sunnyvale, CA Lines: 17