🚀 go-pugleaf

 pkbhatti@kopth004.delcoelect.com (Pardeep K. Bhatti) writes:
>In article <1992Nov18.161229.11293@engr.uark.edu> bic@engr.uark.edu (CHANDRAN BIJU I) writes:
>>Is anyone out there familiar with a book or an article listing the mechanical
>>properties (Youngs modulus, etc.) of common solder materials.
>> 
>
>Welcome to the exotic world of solder materials!!!
>
>There is very limited solder property data in books, but there are a good
>number of technical papers on this subject. A good starting point will be
>the ASME Journal of Electronic Packaging and IEEE Transactions on Components,
>Hybrids, and Manufacturing Technology (CHMT). Also check proceedings from
>ASME WAM conferences from recent years. However, there is a wide variation
>in the published solder property data in the literature. For example, there
>is a 5 to 1 variation in the reported Young's modulus figures for the most
>common solder (63/37 Sn-Pb).
>Pardeep K. Bhatti                         pkbhatti@kopth004.delcoelect.com

You might also consider "Solders and Soldering",by Howard Manko for
sketchy properties. The International Tin Research Institute (ITRI,
Uxbridge England) has a nice compilation of tin based solder
properties which they will send you if you ask nicely.  There's also
the monograph "Solder Mechanics: A State of the Art Assessment",
edited by D. Frear, W.B. Jones and K.R.Kinsman which may include
useful information on solder properties and more importatntly, how to
interpret published properties, i.e., what behavior to expect at what
templerature and stress state conditions.
Steve Axdal
Computing Devices International
app@shamash.cdc.com