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Article #341

Re: common solder materials

#341
From: medlin douglas l
Date: Sat, 21 Nov 1992 20:52
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Try "printed Circuit Handbook" ed. C.L. Coombs (Mcgraw Hill,1988)
chapter 24, "Solder Materials and Processes"
Technical Details
Message-ID: <362@snll-arpagw.llnl.gov>
Path: arc1-ca.pugleaf.net!sparky!uunet!zaphod.mps.ohio-state.edu!cs.utexas.edu!sun-barr!lll-winken!snll-arpagw!dlmedli
References: <1992Nov18.161229.11293@engr.uark.edu>

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Path: arc1-ca.pugleaf.net!sparky!uunet!zaphod.mps.ohio-state.edu!cs.utexas.edu!sun-barr!lll-winken!snll-arpagw!dlmedli
From: dlmedli@snll-arpagw.llnl.gov (medlin douglas l)
Newsgroups: sci.materials,sci.engr,sci.engr.mech
Subject: Re: common solder materials
Keywords: mech props, solder materials
Message-ID: <362@snll-arpagw.llnl.gov>
Date: 21 Nov 92 20:52:41 GMT
References: <1992Nov18.161229.11293@engr.uark.edu>
Organization: Sandia National Labs, Livermore, CA
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