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THE THIRD INTERNATIONAL CONFERENCE ON PUMPS AND FANS (3rd ICPF)

FIRST ANNOUNCEMENT AND CALL FOR PAPERS
October  13-16, 1998
Tsinghua University, Beijing, China
Organized by Tsinghua University, Beijing, China

OBJECTIVE

The first two International Conferences on Pumps and Fans were
successfully
held in Beijing, in May, 1992 and October, 1995. Following the
experiences
of these conferences, the Third International Conference on Pumps and
Fans
will be held on October  13-16, 1998 at Tsinghua University, Beijing.
The conference aims to bring together scientists and engineers of
diverse
experiences to present their latest research findings and exchange ideas
on
the design, research and applications of pumps, fans, blowers,
compressors,
as well as other related fluid machinery.

SCOPE

Specialty:
Pumps, fans, blowers, compressors, ejectors, fluid sealing, valves, as
well
as other related fluid machinery and components.

Contents:
Design and analysis, theory and principles, engineering application,
experimental study, numerical simulation, turbulent flows, cavitation
and
multiphase flows, erosion and silt abrasion, strength and rotordynamics,

noise and vibration, oscillation and unsteady flows, performance and
operation, system and control.

CALL FOR PAPERS

Papers submitted should not have been published previously.  Paper
selection
will be based upon extended abstracts of 2 page length (800 words). They

should clearly state the purpose, method and results of the work.  Three

copies of the abstract should be submitted before January 1, 1998.

WORKING LANGUAGE

Working language of the Conference is English.

TIME TABLE

Extended abstract and Pre-registration form:            Jan. 1, 1998
Notice of acceptance:                   Mar. 1,1998
Manuscript of full length paper:                        Jun. 1, 1998
Registration form:                      July 1, 1998

REGISTRATION FEES

The Conference registration fee is US$ 400 (US$ 350 if paid before
August
15, 1998).  This fee will include one set of the conference proceedings
volumes, attendance to the welcome reception, banquet and entertainment.
The
registration fee for students is US$ 200 (US$ 150 if paid before August
15,
1998).
Registration fee for accompanying persons is US$ 180 (US$  160 if paid
before August 15, 1998).

TIME AND PLACE

The 3rd ICPS will take place in October 13 to 16, 1998 on the campus of
Tsinghua University on the northern suburb of Beijing city, about 15km
from
the downtown area. Technical sessions will be held at the Auditorium and

lecture rooms in Tsinghua Main Building of Tsinghua University.

CONFERENCE PROCEEDINGS

All camera-ready texts of papers submitted before the time limit will be

printed in bound volumes, which will be presented to each delegate upon
registration. Additional copies may be purchased during the Conference.

TECHNICAL VISITS

A comprehensive tour through the laboratories of Universities in Beijing

will be conducted during the conference.

LOCAL TOUR

Sightseeing in Beijing in autumn is enjoyable. A local tour will be
arranged
during the conference.  A special program of visit to scenic spots and
places of interest will be arranged for accompanying persons.

ACCOMMODATIONS

Rooms will be reserved for all participants at the University Hostel
(the
rate for a standard room with two beds is US$ 60 per night) and at the
Friendship Hotel (the rate for a standard room with two beds is about
US$
80-120 per night). Rooms are to be reserved through the Conference
Secretariat by a deposit for one day's occupancy. On receipt of your
Registration Form with deposit, the Secretariat will send you your
booking
confirmation. Accommodations cannot be guaranteed after September 15.

LUNCH

Cafeteria lunch will be served at noon time each day free of charge
(according to lunch cards).

CLIMATE

During the time of the Conference, weather in Beijing is agreeable.
Temperature may vary between 10�� and 20��.

EXHIBITION

Exhibits featuring the latest development in CFD, CAD and Fluid
Machinery
will be staged at the Exhibition Hall of the Main Building. Registration
fee
of a company or institute for participating the exhibition and
presenting 20
minutes* special lecture to Chinese customers is US$ 3,000.

Pre-Registration Form

THE THIRD INTERNATIONAL
CONFERENCE ON PUMPS AND FANS
3rd ICPF)
(Please return before Jan. 1, 1998 with abstract of papers)

Professor  /  Dr.  /  Mr.  /   Ms.

Name:  ________________________________________
               (First)                 (Middle)
(Family)

_____________________  _________________________

Mailing Address:  ________________________________

Post Code:  ______________________________________

Telephone:  _____________________________________

Fax:  __________________________________________

E-mail Address: __________________________________

I would like to attend the conference
I intend to present a paper

Title of paper or lecture: ___________________________

We would like to participate the exhibition     *

We would like to present a special lecture      *

Name of Company or Institute: __________________


CORRESPONDING ADDRESS

Professor Dr. Yu-Lin WU
Department of Hydraulic Engineering
Tsinghua University,  Beijing, P.R. CHINA   100084
Tel: 86-10-62782187, 62782251        Fax: 86-10-62785699
E-mail: wyl-dhh@mail.tsinghua.edu.cn

 ORGANIZING COMMITTEE

Chairman:               Zhi-Cheng GUAN, Tsinghua University
Vice Chairmen: Zu-Yan MEI, Tsinghua University
                Si-Wei ZHANG, University of Petroleum
                H. HASHIMOTO, Ebara Research Co. Ltd.
                D.-H. Hellmann, Kaiserslautern University
                T. IKOHAGI, Tohoku University
                Shin-Hyoung KANG, Seoul National Univ.
                J. H. SCHILL, KSB AG, Univ. of Petroleum
Secretary:      Yu-Lin WU, Tsinghua University

INTERNATIONAL ADVISORY COMMITTEE

A. J. ACOSTA, California Institute of Technology, USA
Tsutomu ADACHI, Osaka Sangyo Univ., Japan
V. BALABASKARAN, Indian Institute of Technology, India
R. Van Den BRAEMBUSSCHE, Von Karman Inst., Belgium
Kang-Rae CHO, Yonsei University, Korea
N. A. CUMPSTY, Cambridge University, UK
H. DAIGUJI, Tohoku University, Japan
M. N. DHAUBHADEL, Automated Analysis Corp., USA
E. EGUSQUIZA, Universitat Politecnica de Catalunya, Spain
T. FRANSSON, Royal Institute of Technology, Sweden
Marjan GANTAR, Turboinstitut, Slovenia
M. GILES, Oxford University, UK
D. GREGORY-SMITH, University of Durham, UK
E. M. GREITZER, Massachusetts Inst. of Technology, USA
E. GOEDE, University of Stuttgart, Germany
S. GOPALAKRISHNAN, BW/IP International Inc., USA
A. GOULAS, Aristotle University of Thessaloniki, Greece
R. GUARGA, University of the Republic, Uruguay
M. GUILBAUD,  Universite de Poitiers, France
W. G. HABASHI, Concordia University, Canada
Hiroshi HAYAMI, Kyushu University, Japan
Makoto HAYASHI, Mech. Engr. Lab. Hitachi Ltd., Japan
Masashiro INOUE, Kyushu University, Japan
Masahiro ISHIDA, Nagasaki University, Japan
D. JAPIKSE, Concepts ETI Incorporated, USA
H. KATO, University of Tokyo, Japan
J. KATZ, John Hopkins University, USA
Kwang-Yong KIM, INHA University, Korea
Naokazu KUBOTA, DMW Corporation, Japan
J. KUROKAWA, Yokohama National University, Japan
R. LEBLANC, CEAT, Universite de Poitiers, France
F. LEBOEUF, Ecole Centrale de Lyon, France
Francesco MARTELLI, University of Florence, Italy
Toshio MASUDA, Tsuchiura Works, Hitachi Ltd., Japan
Yoichiro MATSUMOTO, University of Tokyo, Japan
Yoshio MIMURA, Ebara Material Company, Japan
Kiyoshi MINEMURA, Nagoya Univ., Japan
Yutaka MIYAKE, Osaka University, Japan
Shimpei MIZUKI, Hosei University, Japan
M. A. B. A. MUKTI Hj., University Tech. Malaysia, Malaysia
G. L. MORRISON, Texas A & M University, USA
Michihiro NISHI, Kyushu Inst. of Technology, Japan
Risaburo OBA, Tohoku University, Japan
Warn-Gyu PARK, Pusan National University, Korea
M. RAUTENBERG, University of Hannover, Germany
Ho-Seon REW, LG Electronics Inc., Korea
U. S. ROHATGI, Brookhaven National Laboratory, USA
B. STOFFEL, Technical University of Darmstadt, Germany
F. SPETTEL, Inst. National des Science Applique'es, France
W. TABAKOFF, University of Cincinnati, USA
K. YAMAMOTO, Ebara Research Co. Ltd., Japan
R. YAMANE, Tokyo Institute of Technology, Japan
S.H. WINOTO, National University of Singapore, Singapore
Jian-Zhong XU, Chinese Society of Eng. Thermophysics
Sheng ZHOU, Beijing Univ. of Aeronautics & Astronautics
TECHNICAL COMMITTEE

Chairman:       Zu-Yan MEI, Tsinghua University
Co-Chairmen: D. BOHN, Aachen University of Technology
        B. LAKISHIMINARAYANA, Penn. State Univ.
        J. SATO, Hitachi Works, Hitachi Ltd.
        H. TSUKAMOTO, Kyushu Inst. of Technology
        Dun-Song XUE, University of Petroleum
        Yu-Lin WU, Tsinghua University


----------------------------------
WU  Yulin
Professor of the Division of Fluid Machinery
Department of Hydraulic Engineering
Tsinghua University
Beijing, CHINA 10084
Tel: 86-10-62782187, 62782251, 62785226 (h)
Fax: 86-10-62785699
Email: wyl-dhh@mail.tsinghua.edu.cn