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1 total messages Started by John Nagle Fri, 22 Jan 1993 03:50
Re: Progress on the Mechanical Side
#848
Author: John Nagle
Date: Fri, 22 Jan 1993 03:50
24 lines
1777 bytes
rls@tip.wedge.nt.com (Robert L. Smith) writes:
>    I submit the following as an indication of progress toward
>nanotech in one government agency -- a state government, at that!  It
>doesn't claim the nano scale -- although at least one of the listed
>potential uses would require it -- and the estimated costs of $500 per
>investor are worth a horse laugh.  It's encouraging, even so.  Use it
>as you wish, but be aware that no copyright release has been obtained.

       This is reasonable enough.  It's just a scheme for getting many
projects onto a single wafer before running it through a wafer fab.
This is a routine prototyping technique in IC development, and if you
take an IC design class at a good school, your design may go to fab,
along with that of many others, on a single wafer.  Mead and Conway
pioneered this approach to learning IC design.  

       It actually makes good sense to get people doing this sort of
work together.  One sees pictures of gears and such made by IC fab
techniques, but made by people who don't have an application for tiny
gears.  The technology has been looking for applications.
Useful products may well come out of this effort.

       But it's not nanotechnology.  Orders of magnitude bigger.

					John Nagle
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