Re: TECH: 3DO unveils innovative 'Multiplayer'

Article View: sci.virtual-worlds

Article #3062

Back to sci.virtual-worlds Previous Next

#3062

From: Ronald Logsdon
Date: Tue, 26 Jan 1993 04:28

9 lines
743 bytes


Hello to all

  I just got back fron the Consumer Electronix Show (CES) in
Las Vegas.  At that shoe 3DO made a big hit!!!  The unit is based on
a RISC chip and realy screams!!! I truly think they have a winner!!!

-Ron L.

Technical Details

Message-ID: <1k2tbvINNn83@shelley.u.washington.edu>

Path: arc1-ca.pugleaf.net!sparky!uunet!usc!rpi!usenet.coe.montana.edu!news.u.washington.edu!stein.u.washington.edu!hlab

Show Full Headers

Complete Article Headers

Path: arc1-ca.pugleaf.net!sparky!uunet!usc!rpi!usenet.coe.montana.edu!news.u.washington.edu!stein.u.washington.edu!hlab
From: Ronald Logsdon <shebute@Panix.Com>
Newsgroups: sci.virtual-worlds
Subject: Re: TECH: 3DO unveils innovative 'Multiplayer'
Date: Mon, 25 Jan 1993 23:28:11 -0500 (EST)
Organization: University of Washington
Lines: 9
Approved: cyberoid@milton.u.washington.edu
Message-ID: <1k2tbvINNn83@shelley.u.washington.edu>
NNTP-Posting-Host: stein.u.washington.edu
Originator: hlab@stein.u.washington.edu