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			First call for papers

				EOBT'93

	4th European Conference on Electron and Optical Beam Testing 
			of Electronic Devices 

	Swiss Federal Institute of Technology (ETH), Zurich, Switzerland

			September 1-3, 1993

		      Deadline: March 1, 1993

Fields: Electron Beam Testing, Optical Beam Testing, Scanning Tunneling and
        Other Local Probe Microscopy Methods (STM, AFM) 



Sponsored by: IEEE Switzerland Reliability Chapter

Organized by: ETH Reliability Laboratory


1. General Scope of the Conference

The aim of EOBT is to provide an international biennial forum for the
presentation and the discussion of the advances in internal and contactless
testing by Electron Beam (EBT), by Optical Beam (OBT), and newly by Scanning
Tunneling and other local probe microscopy methods (STM, AFM, etc.). The
Conference covers applications on all types of semiconductors, electronic and
microelectronic integrated circuits (including test structures), and systems. 

Following recent successful conferences in Grenoble (1987), Duisburg (1989)
and Como (1991) the Program Committee solicits contributions for the 1993
Conference in Zurich in the following areas: 

Applications
- Semiconductor devices and integrated circuits; 
- Interconnecting networks, multi-chip technology, micro packaging;
- Design validation

Methods 
- e-beam: secondary electrons, backscattered electrons, EBIC, resistive, and
  capacitive methods; 
- Optical methods: photoexcitation, electro-optical effects, stimulating
  techniques, and alternative methods 
- STM, AFM, other local probe methods

Techniques
- Logic state and waveform analysis
- Signal and image processing
- Beam scanning and sampling techniques for time and frequency domain
- Impressing beam modes for activation and reconfiguration

Equipment
- Signal generation: gun, lasers, needles, choppers, lenses, optics,
  electro-optics 
- Signal detection: detectors, spectrometers
- Positioning and Stimulation: stages, probe cards, ATE connections heating,
  and cooling units 
- Integrated systems: navigation, automation, CAD/CAT-link, FIB

Design for Testability
- Principles, strategies, accuracy improvements, technology limits

Applications for Reliability
- Failure analysis
- Sample preparation techniques
- Reverse engineering
- Twinning with other techniques

2. Submission Deadline
March 1, 1993, Closing date for the submission of abstracts and short
abstracts. 

3. Papers Submission
Papers will be selected on the basis of a 35 word short abstract and an
extended abstract consisting in up to five A4 pages (single column) that
states clearly and concisely the specific results of previously unpublished
work. The working language of the conference will be English and will be used
for all presentations and printed material. After the selection of the papers,
the authors will be informed of the decision of the Program Committee in May
1993 and will receive instructions for the final layout of papers,
transparencies and slides. Papers should be submitted in five copies
preferably by post or express mail to the address mentioned below.

4. Best Poster Award
The EOBT'93 Best Poster Award will be presented before closing the conference.

5. Technical Exhibition
In conjunction with the conference a technical exhibition will take place in
the immediate vicinity of the conference rooms. This exhibit will present
products from the following categories: SEM, Electron Beam Testers, Laser
Microscopes, Atomic Force and Scanning Tunneling Microscopes, and their
accessories. 

Congress Address

Swiss Federal Institute of Technology (ETH)
Reliability Laboratory, EOBT 1993
ETH-Zentrum
CH-8092 Zurich, Switzerland

Tel. ++41 1 256 2743, Fax ++41 1 251 2172

e-mail: eobt93@nimbus.ethz.ch


Conference Committee

Chairman:	Alessandro Birolini, ETH-Zurich, Switzerland
Vice chairmen:	Eckhard Wolfgang, Siemens, Germany
		Mauro Ciappa, ETH-Zurich, Switzerland

Program Committee 

Chairman: Bernard Courtois, IMAG/TIM3, Grenoble, France

R.J. Behm, Univ. Ulm (D); A. Chion, SGS-Thomson, Grenoble (F); M. Ciappa, ETH,
Zurich (CH); Y. Danto, Univ. Bordeaux (F); K. de Kort, Philips Eindhoven (NL);
A. Dinnis, Univ. of Edinburg (UK); F. Fantini, Univ. di Parma (I); D. Jaeger,
Univ. Duisburg (D); E. Kubalek, Univ. Duisburg (D); R. Lackmann, Fraunhofer
Inst., Duisburg (D); J. Madrenas, Univ. Politecnica de Catalunia, Barcelona
(E); M. Melgara, CSELT, Torino (I); J. Mucha Univ. Hannover (D); K.D.
Mueller-Glaser, Univ. of Erlangen (D); E. Munro, Imperial College London (UK);
D. Pohl, IBM, Rueschlikon (CH); D.W. Ranasinghe, British Telecom Lab, Ipswich
(UK); M. Vanzi, Univ. di Cagliari (I); Y.J. Vernay, CNET, Meylan (F); E.
Wolfgang, Siemens, Munich (D). 

Corresponding Members
V.V. Aristov, Academy of Science, Chernogoloka (Russia); H. Fujioka, Univ.
Yamada-Oka, Osaka (J); J.M. Halbout, IBM, Yorktown Heights, (USA); H.
Heinrich, IBM Yorktown Heights, (USA); J. Whitaker, Univ. of Michigan,
Ann-Arbor (USA).