🚀 go-pugleaf

On Sat, 26 Sep 2009 06:34:12 -0700 (PDT), mickgeyver
<eyezkubed@yahoo.com> wrote:

>> � Hand assemble... �no wave solder, no IR oven.
>Done that. Perhaps if I make a frame to clamp it flat during assembly.
>>
  Then your dwell time on each solder joint is way too high.

  Try 1/20th gram per joint, not the half gram per joint the picture
appears to show.  You know...  NASA soldering specs.  As little solder as
is possible and perform the operation quickly.  What I saw looked like
several time the amount needed in the dip chip.  Even the connector was
huge and blobby on the solder joints. The builder does not need to flood
those pins with solder.  The solder only needs to be between the pin and
the board ala SMD soldering.  FILLET not BLOB.

  The soldering iron should also be at 600� F, NOT 800� F.

  If you are having wetting problems due to age of the leads of your
parts or such, you may need to try different solders to see if a
different flux choice might yield a good solder joint faster than your
current choice.

  RMA is harder to clean (hot alcohol bath) but it does make a good, well
wetted solder joint faster in some instances.  I am not sure which flux
choices are the most active these days.  It has been a long time since I
did production level soldering, and we currently use odd technology since
we get exempted from RoHS compliance.