Re: Microelectronic Fabrication

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Article #196

#196

From: Harry Bartholomew
Date: Fri, 14 Aug 1992 11:20

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The etching should leave no Boron residue, and the amount of Boron
in the oxide would not be sufficient to form any acid otherwise all
Boron doped device structures would be vulnerable. 

The phenomenon is well known in macro studies of fracture mechanics
of glass and quartz, called "static fatigue" in that material tested
immediately after fabrication is weakened by time, actually due to
the stress-corrosion of the glass by water absorbed from the ambient.
See Doremus's books and papers for details.

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From: bart@netcom.com (Harry Bartholomew)
Subject: Re: Microelectronic Fabrication
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Date: Fri, 14 Aug 92 11:20:23 GMT
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