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In article <38005@uflorida.cis.ufl.edu>, sushilb@elm.circa.ufl.edu (Sushil Bharatan) writes:
>I require information on preparation of cross-sectional TEM samples
>of a semi-conductor material deposited on 0001 sapphire substrate.
>I am currently using a dicing saw for cutting strips that are about
>15 mils in width, but extensive cracking and chipping occur.
>Any information on dicing saw blade manufacturers and alternative
>methods is welcome.
>
>Thanks,
>Sushil Bharatan
>Dept. of Materials Science and Engineering,
>University of Florida.
>
>email:sushilb@elm.circa.ufl
>

	Sushil,

		Dicing saw may not be a good thing to use to cut non-metallic
	samples. Instead, you may use a diamond wafering blade with water as
	the cutting fluid. If you are going to make TEM samples, you need
	lot less thicker sample than 15 mil. It is wiser to cut a little
	thicker and then polish it to thin.

	-Anis.