🚀 go-pugleaf

In article <1992Nov18.161229.11293@engr.uark.edu> bic@engr.uark.edu (CHANDRAN BIJU I) writes:
>Is anyone out there familiar with a book or an article listing the mechanical
>properties (Youngs modulus, etc.) of common solder materials.
> 

Welcome to the exotic world of solder materials!!!
It is very difficult to get good, reliable data on mechanical properties of
solder materials. Most common solder materials have highly nonlinear
constitutive stress-strain relationships, which are also very temperature
dependent. Furthermore, they exhibit creep and plasticity phenomena which
dominate their mechanical behavior in their normal operating temperature
range.

There is very limited solder property data in books, but there are a good
number of technical papers on this subject. A good starting point will be
the ASME Journal of Electronic Packaging and IEEE Transactions on Components,
Hybrids, and Manufacturing Technology (CHMT). Also check proceedings from
ASME WAM conferences from recent years. However, there is a wide variation
in the published solder property data in the literature. For example, there
is a 5 to 1 variation in the reported Young's modulus figures for the most
common solder (63/37 Sn-Pb).

Good luck with your search...
-- 
Pardeep K. Bhatti                         pkbhatti@kopth004.delcoelect.com
Delco Electronics Corporation
GM Hughes Electronics
***  The opinions expressed are mine, not necessarily of my employer.  ***