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In article <1992Nov18.161229.11293@engr.uark.edu> bic@engr.uark.edu (CHANDRAN BIJU I) writes:
>Is anyone out there familiar with a book or an article listing the mechanical
>properties (Youngs modulus, etc.) of common solder materials.
> 

Welcome to the exotic world of solder materials!!!
It is very difficult to get good, reliable data on mechanical properties of
solder materials. Most common solder materials have highly nonlinear
constitutive stress-strain relationships, which are also very temperature
dependent. Furthermore, they exhibit creep and plasticity phenomena which
dominate their mechanical behavior in their normal operating temperature
range.

There is very limited solder property data in books, but there are a good
number of technical papers on this subject. A good starting point will be
the ASME Journal of Electronic Packaging and IEEE Transactions on Components,
Hybrids, and Manufacturing Technology (CHMT). Also check proceedings from
ASME WAM conferences from recent years. However, there is a wide variation
in the published solder property data in the literature. For example, there
is a 5 to 1 variation in the reported Young's modulus figures for the most
common solder (63/37 Sn-Pb).

Good luck with your search...
-- 
Pardeep K. Bhatti                         pkbhatti@kopth004.delcoelect.com
Delco Electronics Corporation
GM Hughes Electronics
***  The opinions expressed are mine, not necessarily of my employer.  ***

 pkbhatti@kopth004.delcoelect.com (Pardeep K. Bhatti) writes:
>In article <1992Nov18.161229.11293@engr.uark.edu> bic@engr.uark.edu (CHANDRAN BIJU I) writes:
>>Is anyone out there familiar with a book or an article listing the mechanical
>>properties (Youngs modulus, etc.) of common solder materials.
>> 
>
>Welcome to the exotic world of solder materials!!!
>
>There is very limited solder property data in books, but there are a good
>number of technical papers on this subject. A good starting point will be
>the ASME Journal of Electronic Packaging and IEEE Transactions on Components,
>Hybrids, and Manufacturing Technology (CHMT). Also check proceedings from
>ASME WAM conferences from recent years. However, there is a wide variation
>in the published solder property data in the literature. For example, there
>is a 5 to 1 variation in the reported Young's modulus figures for the most
>common solder (63/37 Sn-Pb).
>Pardeep K. Bhatti                         pkbhatti@kopth004.delcoelect.com

You might also consider "Solders and Soldering",by Howard Manko for
sketchy properties. The International Tin Research Institute (ITRI,
Uxbridge England) has a nice compilation of tin based solder
properties which they will send you if you ask nicely.  There's also
the monograph "Solder Mechanics: A State of the Art Assessment",
edited by D. Frear, W.B. Jones and K.R.Kinsman which may include
useful information on solder properties and more importatntly, how to
interpret published properties, i.e., what behavior to expect at what
templerature and stress state conditions.
Steve Axdal
Computing Devices International
app@shamash.cdc.com

Try "printed Circuit Handbook" ed. C.L. Coombs (Mcgraw Hill,1988)
chapter 24, "Solder Materials and Processes"